Imaging Chip Adhesive Heat Path Without Light Shielding
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Solution Overview
Problem
Conventional semiconductor devices with solid-state imaging elements face challenges in heat dissipation, which can degrade image quality due to temperature distribution variations, as existing cooling methods either obstruct light or are inefficient.
Innovation Solution
A semiconductor device design featuring a substrate with metal wiring and an adhesive portion of predetermined thermal conductivity, where the adhesive portion adheres to the solid-state imaging element, allowing heat to be dissipated through the metal wiring, with varying area, density, and shape of exposed portions corresponding to temperature distribution, and using different types of adhesives for optimal heat radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling member is provided on the surface of the semiconductor chip to discharge heat, then heat dissipation is improved, but light shielding occurs and imaging characteristics are impaired
Solution Approach 1:
Instead of placing the cooling member on the light-receiving surface of the semiconductor chip, the invention inverts the approach by adhering the semiconductor chip to the substrate such that the back surface (opposite to the light-receiving surface) contacts the substrate. This allows heat dissipation through the substrate while keeping the light-receiving surface exposed and unobstructed.
Solution Approach 2:
The substrate acts as an intermediary medium for heat dissipation. Rather than directly cooling the chip surface, the substrate serves as a thermal conduit that transfers heat from the chip's back surface to the mounting board, enabling indirect cooling without interfering with light reception.
2Temperature
If conventional cooling methods are used, then heat dissipation is attempted, but temperature distribution variation degrades image quality
Solution Approach 1:
The adhesive portion is designed with specific thermal conductivity properties tailored for heat dissipation. By selecting adhesive material and configuring its thickness and area according to local heat generation patterns, the invention achieves optimized temperature distribution across the chip surface, preventing localized overheating that would degrade image quality.
Solution Approach 2:
The invention changes the thermal parameters of the bonding interface by using adhesive with predetermined thermal conductivity. This parameter optimization ensures efficient heat transfer while maintaining appropriate temperature distribution, thereby preserving image quality during operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design efficiently dissipates heat without impairing imaging characteristics, maintaining image quality by aligning heat dissipation with temperature distribution patterns, ensuring effective cooling while allowing light exposure.
Implementation Method 1
an adhesive portion having predetermined thermal conductivity, the adhesive portion that adheres a predetermined region on one surface of the solid-state imaging element to the substrate... discharging heat generated in the solid-state imaging element toward the metal wiring of the substrate via the adhesive portion
Data Source
AI summary
Heat is efficiently discharged without impairing an imaging characteristic of a solid-state imaging element mounted on a substrate. A semiconductor device is provided with a substrate, the solid-state imaging element, and an adhesive portion that adheres the substrate and the solid-state imaging element. The substrate is a substrate provided with metal wiring. The solid-state imaging element is mounted on a surface of the substrate. The adhesive portion adheres a predetermined region on one surface of the solid-state imaging element to the substrate. The adhesive portion has predetermined thermal conductivity and discharges heat generated in the solid-state imaging element toward the substrate.