Solid-State Imaging Chip Flexible Board Connection
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Solution Overview
Problem
Existing solid-state imaging apparatus using flexible boards face challenges in reducing size due to limitations in bendability and manufacturing complexity, which hinders the miniaturization of imaging units and lowers reliability.
Innovation Solution
The solution involves connecting the electrode pad of the solid-state imaging device chip with a connecting electrode on the flexible board through wire bonding or flip chip bonding, using a thickened or post electrode configuration to ensure reliable electrical connection without the need for a bend portion, thereby simplifying manufacturing and enhancing reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a thin portion is formed on the base film of the flexible board to prevent edge short, then edge short is prevented, but tenacity against bend increases and bendability is hindered
Solution Approach 1:
The invention extracts and removes the problematic thin portion (cutout) from the base film of the flexible board. Instead of having a thin portion that compromises bendability, the flexible board is designed without any cutouts or thin portions in the base film, allowing the inner lead to extend to the edge without requiring a thinning section for bending.
Solution Approach 2:
The invention changes the spatial arrangement by extending the inner lead to the edge of the flexible board in a straight configuration rather than requiring it to bend at a thin portion. This dimensional reorganization eliminates the need for the thin portion while maintaining electrical connection integrity.
2Reliability
If the inner lead is bent along the side face of the solid-state imaging device, then connection is achieved, but the radius of curvature increases and size reduction is hindered
Solution Approach 1:
The invention removes the bend portion (curved section) from the inner lead configuration. The inner lead is designed to extend straight to the edge of the flexible board and connect to the electrode pad, eliminating the need for a curved section with a large radius of curvature.
Solution Approach 2:
The invention repositions the connection point by extending the inner lead to the edge of the flexible board in a straight line, allowing connection to the electrode pad without requiring a bent configuration. This reduces the terminal end portion size to essentially the thickness of the flexible board.
3Reliability
If a thin portion is formed on the base film, then edge short is prevented, but a special processing step is required and manufacturing becomes more complex
Solution Approach 1:
The invention extracts and eliminates the thin portion (cutout) from the flexible board design. By removing this feature entirely, the special processing step required to create the thin portion is no longer needed, simplifying the manufacturing process.
Solution Approach 2:
The flexible board is designed to function without requiring special thinning processing. The base film maintains uniform thickness throughout, and the inner lead extends to the edge to provide edge short prevention without needing a thin portion, making the manufacturing process self-sufficient and simpler.
4Reliability
If the inner lead is bent and the flexible board is constructed with a thin portion, then edge short is prevented, but work becomes complicated and yield decreases
Solution Approach 1:
The invention removes both the thin portion and the bent configuration of the inner lead. The inner lead extends straight to the edge of the flexible board, eliminating the complexity of bending operations and associated quality issues that reduce yield.
Solution Approach 2:
The simplified design where the inner lead extends straight to the edge without bending or requiring thin portions reduces manufacturing complexity and improves yield. The uniform thickness flexible board with straight lead extension is easier to manufacture with higher consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a reduction in size of the terminal end portion, increases yield, reduces costs, and improves reliability by eliminating the need for complex bend portions and special processing steps, while ensuring secure and reliable electrical connections.
Implementation Method 1
a flexible board having a connecting electrode formed on an end face and being adhered at an end portion thereof to a side face of the solid-state imaging device chip
Implementation Method 2
The electrode pad of the solid-state imaging device chip and the connecting electrode of the flexible board are electrically connected to each other
Implementation Method 3
The electrode pad of the solid-state imaging device chip and the connecting electrode of the flexible board are electrically connected to each other
Data Source
AI summary
A solid-state imaging apparatus including: a solid-state imaging device chip having an electrode pad provided on its front face; and a flexible board having a connecting electrode formed on an end face and being adhered at an end portion thereof to a side face of the solid-state imaging device chip so that the connecting electrode is positioned substantially in the same place as the electrode pad of the solid-state imaging device chip. The electrode pad of the solid-state imaging device chip and the connecting electrode of the flexible board are electrically connected to each other.