Solid-State Imaging Device Thermal Management via Partial Adhesive Bonding
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Solution Overview
Problem
Solid-state imaging devices face issues with poor heat dissipation and deformation due to the use of resin for sealing wires and adhesive application covering the entire rear surface, leading to increased stress from thermal expansion differences.
Innovation Solution
A solid-state imaging device design featuring a dielectric substrate, a solid-state imaging element, connection conductors, a frame-shaped spacer, and an optical lid, where the adhesive is applied only to a portion of the rear surface to allow air flow, and the spacer and sealant are used to create air vents and expose side surfaces, improving heat dissipation and reducing deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If resin is used to seal the wires covering the entire periphery of the solid-state imaging element, then the manufacturing process is simplified and wires are protected, but heat dissipation becomes poor and the solid-state imaging element deforms due to thermal expansion stress
Solution Approach 1:
The patent divides the sealing structure into multiple parts: a first sealant seals the connection conductors, while a second sealant seals the solid-state imaging element. This segmentation allows different sealing approaches for different components, enabling heat dissipation paths to be maintained while still providing necessary protection and simplifying manufacturing.
2Strength
If adhesive is applied to the entire rear surface of the solid-state imaging element, then the element is securely fixed to the substrate, but stress increases due to thermal expansion coefficient differences causing deformation
Solution Approach 1:
The patent applies adhesive only to specific regions of the solid-state imaging element rather than the entire rear surface. This localized adhesive application maintains sufficient fixing strength while reducing the total area subject to thermal expansion stress, thereby preventing deformation.
3Object-affected harmful factors
If the package covers all surfaces of the solid-state imaging element, then the element is protected from environmental factors, but heat dissipation is significantly reduced
Solution Approach 1:
The patent segments the protective packaging into selective areas using two different sealants. The first sealant protects connection conductors while allowing heat dissipation paths, and the second sealant protects specific areas of the solid-state imaging element. This segmented approach provides environmental protection without completely enclosing the element, maintaining heat dissipation capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances heat dissipation and reduces deformation by allowing air flow and exposing side surfaces, maintaining image quality and reducing thermal stress on the imaging element.
Implementation Method 1
an air flow path generation portion between the dielectric substrate and the solid-state imaging element, wherein air flows to remove heat from the solid-state imaging element
Implementation Method 2
an adhesive, which is in contact with a portion of the rear surface of the solid-state imaging element
Data Source
AI summary
A solid-state imaging device includes a dielectric substrate, a solid-state imaging element disposed on the dielectric substrate, and including a photosensitive unit at a portion of a front surface thereof, an adhesive between the dielectric substrate and the solid-state imaging element, connection conductors, a sealant, and an upper package part. The solid-state imaging element includes a photosensitive unit at a portion of a front surface thereof, and is bonded to the dielectric substrate by the adhesive such that the adhesive is in contact with a portion of a rear surface of the solid-state imaging element so as to permit air flow along other portions of the rear surface of the solid-state image element. The connection conductors electrically connect the solid-state imaging element and the dielectric substrate. The upper package part is provided on the front surface of the solid-state imaging element so as to hermetically seal the photosensitive unit.