3D-Printed Imaging Package Frame for Stray Light Suppression
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Solution Overview
Problem
The increasing demand for smaller and higher definition solid-state imaging device packages poses a challenge in reducing noise in photographed images, as existing technologies struggle to effectively suppress unwanted light and image artifacts like flares and ghosts.
Innovation Solution
A manufacturing method involving a 3D printer to form a frame with specific surface roughness and wave patterns on the inner peripheral surface, which is then bonded to a solid-state imaging device and a transparent substrate, creating a sealed space that minimizes light incidence and reflection, thereby reducing image noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a frame with smooth inner peripheral surface is used, then manufacturing precision is improved, but image noise increases due to light reflection
Solution Approach 1:
The frame's inner peripheral surface is given a specific roughness (Ra: 50nm-30μm) only in the light incident region, while other parts of the frame maintain smooth surfaces for manufacturing precision. This localized surface treatment reduces light reflection and image noise without compromising overall manufacturing quality.
Solution Approach 2:
The surface roughness parameter of the frame's inner peripheral surface is controlled within a specific range (Ra: 50nm-30μm) to optimize light scattering properties. This parameter change transforms the surface from either too smooth (causing reflection) or too rough (difficult to manufacture) to an optimal intermediate state that reduces image noise while remaining manufacturable.
2Device complexity
If the frame is formed by conventional manufacturing methods, then manufacturing complexity is reduced, but surface roughness control precision deteriorates
Solution Approach 1:
Conventional mechanical machining methods are replaced with a 3D printing system that can directly form the frame with the required surface roughness (Ra: 50nm-30μm) through controlled material deposition. This substitution enables precise surface roughness control without complex mechanical machining processes.
Solution Approach 2:
The 3D printing process parameters (layer thickness, deposition rate, curing conditions) are optimized to directly achieve the target surface roughness range (Ra: 50nm-30μm) on the frame's inner peripheral surface, eliminating the need for additional surface treatment steps and simplifying the overall manufacturing process.
3Object-affected harmful factors
If the frame completely blocks light, then image noise is reduced, but useful light for imaging is also blocked
Solution Approach 1:
The frame's light-blocking property is applied locally only to the inner peripheral surface where light reflection occurs, while the rest of the optical path remains transparent. The specific surface roughness (Ra: 50nm-30μm) on the inner peripheral surface scatters reflected light away from the optical path without affecting useful light transmission through the frame body.
Solution Approach 2:
Instead of completely blocking light with the frame, the invention utilizes controlled light scattering through the roughened inner peripheral surface (Ra: 50nm-30μm) to redirect unwanted reflected light away from the optical path. This converts the potentially harmful reflection into beneficial scattered light that does not interfere with imaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves a significant reduction in image noise and enhances imaging quality by precisely controlling the surface roughness and wave patterns on the frame, allowing for high-definition imaging while maintaining structural integrity and reliability.
Implementation Method 1
forming the frame by laminating a resin in multiple layers by a 3D printer
Implementation Method 2
the inner peripheral edge of a pattern of the resin to be laminated corresponding to the inner peripheral surface of the frame is formed into a wave shape, and the resin is laminated to shift a phase of the wave shape for each layer
Data Source
AI summary
A solid-state imaging device package comprises a solid-state imaging device including a functional portion that performs imaging at the center portion of a surface, a frame provided to surround the functional portion at the outer peripheral portion of the solid-state imaging device, and a transparent substrate that is opposite to the functional portion and fixed to the frame to cover the solid-state imaging device. A manufacturing method includes the steps of forming the frame by laminating a resin in multiple layers by a 3D printer on either one of the solid-state imaging device or the transparent substrate, and bonding one other of the solid-state imaging device or the transparent substrate to the frame. The step of forming the frame further includes laminating the resin so that a surface roughness Ra of an inner peripheral surface of the frame is 50 nm or more and 30 μm or less.