Solid-state imaging device protrusion recess interface
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Solution Overview
Problem
The existing solid-state imaging devices face a yield reduction issue due to peeling at the interface between the organic layer and the opposite electrode during the back grinding process, which is not effectively addressed by existing technologies.
Innovation Solution
A solid-state imaging device with a protrusion and recess section on the surface of the organic layer opposite to the pixel electrodes and the space between them, where the width of the protrusion or recess satisfies 1/50<a<1, and a maximum inclination angle of the protrusion and recess section is less than or equal to 50°, preventing peeling and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If back grinding is performed to reduce device thickness, then the thickness of the solid-state imaging device is reduced, but peeling occurs at the interface between the organic layer and the opposite electrode
Solution Approach 1:
The invention introduces protrusions and recesses with curved surfaces at the interface between the organic layer and the opposite electrode. The protrusions have rounded tops and the recesses have curved bottoms, creating a mechanically interlocked structure that prevents peeling during back grinding. This curved geometry distributes stress more effectively than flat interfaces, maintaining adhesion while allowing thickness reduction.
Solution Approach 2:
The invention transitions from a two-dimensional flat interface to a three-dimensional structured interface by adding protrusions and recesses. This dimensional change creates additional mechanical anchoring points that prevent peeling during back grinding, allowing the device to be thinned without compromising interface integrity.
2Device complexity
If the width of protrusion or recess is made very small, then the device structure remains compact, but the protrusion and recess section cannot effectively prevent peeling
Solution Approach 1:
The invention specifies optimal parameter ranges for the protrusions and recesses: width of 1/50 to 1 times the pixel electrode width, height of 1/10 to 1 times the organic layer thickness, and inclination angles between 0-45 degrees. These parameter changes ensure the protrusions and recesses are large enough to provide mechanical interlocking and prevent peeling, while remaining within compact dimensions that do not excessively increase device complexity.
Data Source
AI summary
A solid-state imaging device includes a plurality of pixel electrodes disposed two-dimensionally, an opposite electrode provided opposite to the pixel electrodes, and an organic layer formed of an organic material and provided between the pixel electrodes and the opposite electrode, in which a protrusion and recess section is formed on a surface of the organic layer on the opposite electrode side, and the protrusion and recess section includes a first protrusion and recess section formed at a position opposite to each pixel electrode and a second protrusion and recess section formed at a position opposite to the space between each pixel electrode.