Imaging Apparatus Sensor Fixation Using Thick Adhesive and Movement Suppression
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Solution Overview
Problem
Conventional imaging apparatuses face issues with positional displacement of the image sensor due to screw fastening and temperature changes, leading to deterioration in image-forming characteristics, particularly caused by thermal expansion of adhesives used for fixation.
Innovation Solution
An imaging apparatus design that includes an image-forming optical system assembly, an image sensor, a sensor retaining portion, and a movement suppressing member, where the image sensor and imaging lens are fixed using a thicker adhesive with a gap for relative position adjustment, and a metal or resin movement suppressing member is used to counteract thermal expansion, preventing displacement and maintaining image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If adhesive is used to fix the image sensor to prevent positional displacement during assembly, then assembly precision is improved, but thermal expansion of the adhesive causes positional displacement under temperature change
Solution Approach 1:
The patent changes the physical state of the adhesive from thin film to thick gel状 adhesive, fundamentally altering its thermal expansion characteristics. The thick adhesive layer (0.5-2mm) undergoes volume expansion rather than planar displacement, preventing image sensor position shift while maintaining bonding functionality.
Solution Approach 2:
The patent introduces a movable member (resin member or metal member) as an intermediary between the image sensor and the adhesive. This intermediary absorbs the thermal expansion forces through controlled movement, preventing direct transmission of expansion forces to the image sensor position.
2Strength
If screw fastening is used to fix the circuit board, then mechanical strength is improved, but positional displacement occurs due to co-rotation and over-fastening
Solution Approach 1:
The patent replaces the mechanical screw fastening system with a chemical bonding system using thick adhesive. This substitution eliminates the co-rotation and over-fastening problems inherent in mechanical fastening while providing sufficient fixation strength through the adhesive's bonding properties.
3Manufacturing precision
If thin adhesive is used for fixation, then manufacturing precision is improved, but thermal expansion has negligible effect
Solution Approach 1:
The patent inverts the conventional approach by using thick adhesive instead of thin adhesive. This inversion transforms the thermal expansion from a harmful planar displacement force into a manageable volume expansion, fundamentally changing how thermal effects manifest and can be controlled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents positional displacement of the image sensor and reduces deterioration in image-forming characteristics under temperature changes, ensuring stable image formation by using a thicker adhesive and a movement suppressing member to counteract thermal expansion forces.
Implementation Method 1
a first adhesive that at least a portion of a gap between the optical system-side adhesive surface and the sensor-side adhesive surface is filled with, and that comes into close contact with both of the optical system-side adhesive surface and the sensor-side adhesive surface
Implementation Method 2
the deterioration in image-forming characteristics is caused by thermal expansion/thermal contraction of adhesive which is used to fix the image sensor under the temperature change
Implementation Method 3
a movement suppressing member that comes into contact with the opposite surface, and that comes into contact with the sensor retaining portion on a surface facing the rear side
Data Source
AI summary
An imaging apparatus includes an image-forming optical system assembly, an image sensor, a sensor retaining portion that retains the image sensor, a coupling portion that is fixed to the image-forming optical system assembly, and a movement suppressing member that is immovable with respect to the coupling portion. The image-forming optical system assembly includes an optical system-side adhesive surface, the coupling portion includes an opposite surface, and the sensor retaining portion includes a sensor-side adhesive surface. A first adhesive is filled in at least a portion of a gap between the optical system-side adhesive surface and the sensor-side adhesive surface, and comes into contact with both of the optical system-side adhesive surface and the sensor-side adhesive surface. The movement suppressing member contacts the opposite surface, and contacts the sensor retaining portion on a surface facing the rear side out of surfaces of the sensor retaining portion.