Imaging Control Substrate Layout for Multi-Sensor Compatibility
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing imaging control substrates are not compatible with various imaging elements, requiring separate configurations for different models, which increases manufacturing costs and complicates the routing of wiring groups.
Innovation Solution
An imaging control substrate with a processor having differential signal input terminals, a power control circuit, dedicated connectors for power and differential signal transmission lines, and a flexible substrate connecting the imaging substrate and control substrate, allowing for compatibility with multiple imaging elements without changing the substrate configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate substrate configurations are used for different imaging element models, then compatibility with various imaging elements is improved, but device complexity and manufacturing costs increase
Solution Approach 1:
The control substrate is designed with a universal configuration that can accommodate multiple types of imaging elements. The substrate includes standardized connectors and wiring groups that work with different imaging element formats, eliminating the need for model-specific substrate designs. This allows a single substrate design to serve multiple functions across different product variants.
Solution Approach 2:
The substrate configuration is divided into standardized functional modules: power supply lines connected to a first connector, differential signal transmission lines connected to a second connector, and distinct wiring groups. This segmentation allows flexible assembly and maintains compatibility across different imaging element types while simplifying the overall design process.
2Adaptability or versatility
If separate substrate configurations are used for different imaging element models, then compatibility with various imaging elements is improved, but manufacturing costs increase
Solution Approach 1:
By designing a universal control substrate that can accommodate multiple imaging element types through standardized connectors and wiring arrangements, the patent eliminates the need to manufacture different substrate variants for different models. This significantly reduces manufacturing costs while maintaining compatibility across product lines.
Solution Approach 2:
The substrate design uses standardized parameters for connector positions, wiring group configurations, and signal transmission paths that can accommodate different imaging elements without requiring physical redesign. This parameter standardization enables cost-effective mass production of a single substrate type for multiple applications.
3Adaptability or versatility
If separate substrate configurations are used for different imaging element models, then compatibility with various imaging elements is improved, but wiring routing complexity increases
Solution Approach 1:
The wiring is segmented into distinct groups: power supply lines routed to a first connector, differential signal transmission lines routed to a second connector, and separate wiring groups for different functional blocks. This segmentation simplifies routing by assigning dedicated paths to each function, reducing overall wiring complexity while maintaining versatility.
Solution Approach 2:
The substrate layout organizes wiring groups and connectors in a spatial arrangement that separates power, signal, and control lines into different regions or layers. This dimensional organization reduces routing complexity by preventing signal interference and simplifying the physical layout process across different imaging element configurations.
Data Source
AI summary
An imaging control substrate includes: a processor having a plurality of differential signal input terminals into which a signal output from an imaging element is to be input; a power control circuit that controls electric power supplied to the imaging element; a first connector to which a power supply line that supplies the electric power controlled by the power control circuit to an imaging substrate mounted with the imaging element is connected; a second connector to which only a differential signal transmission line that transmits an output signal of the imaging element is connected; and a wiring group that connects the second connector and the plurality of differential signal input terminals.