Immersion Boiling Surface for Higher Bubble Cooling Efficiency
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Solution Overview
Problem
Existing immersion cooling systems for electronic components are inefficient in producing bubbles, which limits their ability to effectively dissipate heat and meet the cooling demands of high-performance electronic components.
Innovation Solution
The immersion boiler incorporates a boiling enhancement layer with a higher specific surface area on its main heat zone compared to its secondary heat zone, increasing the contact area between the working fluid and the heat conductor's fin portions, thereby enhancing bubble production and heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional immersion cooling system is used, then the electronic component can be cooled, but the bubble production efficiency is inadequate and cooling efficiency cannot meet user requirements
Solution Approach 1:
The patent applies porous metal materials to construct the boiling enhancement layer, which provides numerous nucleation sites for bubble formation. The porous structure increases the surface area and creates capillary effects that enhance bubble production efficiency, directly addressing the inadequate bubble production in conventional immersion cooling systems
Solution Approach 2:
The patent implements local quality by creating a boiling enhancement layer with specific porous characteristics at the heat dissipating surface where bubble production is most critical. This localized enhancement focuses the bubble production capability exactly where the heat flux is highest, optimizing cooling efficiency without modifying the entire heat conductor
2Productivity
If the contact area between working fluid and heat conductor is increased, then heat dissipation efficiency improves, but the device structure becomes more complex
Solution Approach 1:
The patent extends the heat dissipation surface into a third dimension by adding fin portions that protrude from the base portion. This dimensional extension significantly increases the contact area between the working fluid and heat conductor without requiring a larger footprint, thereby improving heat dissipation efficiency while maintaining compact device dimensions
Solution Approach 2:
The porous boiling enhancement layer adds surface area at the micro-scale level without significantly increasing device volume. The porous structure provides extensive internal surface area for heat transfer within a thin layer, increasing fluid contact area while maintaining a compact overall structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The boiling enhancement layer increases the efficiency of heat dissipation by enhancing the area of contact between the working fluid and the heat conductor, leading to increased bubble production and improved cooling efficiency.
Implementation Method 1
The heat conductor comprises a base portion and can comprise multiple fin portions. The base portion comprises a heat receiving surface and a heat dissipating surface which are opposite each other. The fin portions can protrude from the heat dissipating surface of the base portion.
Implementation Method 2
the liquid working fluid is heated through contact with the boiler, thereby undergoing a phase change, and thus evaporating to become gaseous working fluid, so as to produce bubbles and carry away heat generated by the electronic component
Implementation Method 3
the liquid working fluid is heated through contact with the boiler, thereby undergoing a phase change, and thus evaporating to become gaseous working fluid
Implementation Method 4
a position for bubble production can be provided, by means of the boiling enhancement layer, for example such that the working fluid undergoes a phase change to carry away heat more efficiently, for example so that liquid working fluid evaporates by being heated to become gaseous working fluid, thus producing bubbles
Data Source
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AI summary
Immersion-type heat dissipating device thermally coupled to heat source includes heat conductor and boiling enhancement layer. The heat conductor includes a plurality of fin portions and a base portion, which is thermally coupled to the heat source and has heat receiving surface and heat dissipating surface opposite to each other. The fin portions protrude from the heat dissipating surface of the base portion. The boiling enhancement layer, which is disposed on at least part of the heat dissipating surface and at least part of the fin portions, includes at least one first metal portion and at least one second metal portion. A specific surface area of the at least one first metal portion is larger than a specific surface area of the at least one second metal portion.