Liquid Immersion Cooling Robot for High-Density Server Systems
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Solution Overview
Problem
Traditional computing systems face inefficiencies in cooling due to the constant need for air cooling, which limits the density of computer components and increases energy consumption, and existing liquid cooling methods require constant fluid replenishment to prevent exposure to gaseous atmospheres, risking component damage.
Innovation Solution
A pressure-controlled vessel utilizing a dielectric fluid that allows computer components to be submerged in a liquid bath with a vapor management system, where the vapor is condensed back into liquid, maintaining a vacuum to reduce boiling point and prevent fluid loss, thereby enhancing cooling efficiency and component density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If traditional air cooling is used, then components can be cooled, but energy consumption increases and component density is limited
Solution Approach 1:
The patent applies liquid immersion cooling by submerging computer components in a dielectric liquid, replacing traditional air cooling systems. The liquid cooling system enables direct heat transfer from components to the cooling fluid, significantly improving cooling efficiency and allowing higher component density while reducing energy consumption compared to air cooling methods
Solution Approach 2:
The patent utilizes phase transition of the dielectric liquid between liquid and vapor states to enhance cooling efficiency. The system allows the liquid to vaporize near heat-generating components, absorbing latent heat, and then condenses the vapor back to liquid in a heat exchanger, creating a continuous two-phase cooling cycle that improves heat removal capability
2Temperature
If liquid cooling with direct contact is used, then cooling efficiency improves, but fluid loss and component exposure to gaseous atmosphere occurs
Solution Approach 1:
The patent creates a sealed enclosure filled with dielectric liquid that forms a protective atmosphere around computer components. This liquid atmosphere prevents oxidation and damage from gaseous environments while maintaining direct thermal contact between components and cooling fluid. The sealed system with vapor condensation recycles minimize fluid loss
Solution Approach 2:
The patent implements a continuous vapor condensation system that constantly converts vaporized dielectric liquid back into liquid form and returns it to the immersion bath. This continuous cycle prevents fluid loss by ensuring that any vaporized coolant is recovered and reused, maintaining a closed-loop system that eliminates the need for frequent fluid replenishment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables increased computing power density and reduced energy consumption by maintaining components at stable temperatures and preventing fluid loss, while also reducing the need for constant fluid replenishment.
Implementation Method 1
computer components and other electronics may be submerged in a dielectric or electrically non-conductive liquid in order to draw heat directly from the component into the liquid
Implementation Method 2
the pressure controlled vessel also contains an atmosphere comprising gaseous dielectric fluid and a condensing system to cool and convert the gaseous dielectric fluid to liquid dielectric fluid
Implementation Method 3
The disclosed pressure management system allows the disclosed embodiment to operate under a vacuum, thereby reducing the temperature at which dielectric fluid vaporizes
Data Source
AI summary
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using a pressure controlled vessel and pressure controller, the disclosed system may be operated at less than ambient pressure. By controlling the pressure at which the system operates, the user may influence the temperature at which the dielectric fluid vaporizes and thereby achieve increased performance from a given computer component. Utilizing robotic arms and slot-in computing components, a self-healing computing system may be created.