Immersion Cooling Vessel Pressure Control for Heat Management
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Solution Overview
Problem
Traditional computing systems face inefficiencies in cooling due to the limitations of air cooling methods, which can lead to increased energy consumption and reduced performance, especially in high-density computing environments where heat management is critical.
Innovation Solution
The implementation of a pressure-controlled vessel using a dielectric fluid that allows for direct immersion cooling, combined with vapor and pressure management systems, to maintain optimal temperatures and enhance cooling efficiency by controlling the boiling point of the fluid and utilizing condensation to recycle the vapor back into liquid form.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air cooling methods are used in traditional computing systems, then the cooling system is simple to implement, but energy consumption increases and cooling efficiency decreases in high-density environments
Solution Approach 1:
The patent changes the physical parameters of the cooling system by transitioning from air cooling to liquid immersion cooling with dielectric fluid, and further modifies the operating pressure parameters to maintain vacuum conditions. This allows the system to achieve superior cooling efficiency in high-density environments while managing energy consumption through optimized heat transfer parameters
Solution Approach 2:
The patent utilizes phase transitions of the dielectric fluid, particularly the vaporization and condensation cycles, to enhance heat removal from computing components. The fluid absorbs heat through phase change from liquid to vapor at controlled rates, then condenses back to liquid in heat exchangers, providing efficient cooling without requiring high energy input
2Productivity
If liquid immersion cooling with dielectric fluid is implemented, then cooling efficiency increases and computing density can be enhanced, but system complexity increases due to pressure and vapor management requirements
Solution Approach 1:
The patent employs a vacuum environment as an inert atmosphere within the sealed enclosure, eliminating air and other gases that could interfere with the dielectric fluid's performance. This inert environment prevents oxidation, reduces heat transfer resistance, and allows the dielectric fluid to operate at optimized temperatures and pressures, thereby enabling higher computing density without proportionally increasing system complexity
Solution Approach 2:
The patent implements feedback control mechanisms through sensors that monitor temperature, pressure, and vapor concentration within the enclosure. These sensors provide real-time data to control systems that adjust vacuum pump operation, fluid circulation rates, and heat exchanger performance, automatically maintaining optimal conditions for high computing density while managing system complexity through automated regulation
3Temperature
If vacuum pressure is maintained in the enclosure, then the dielectric fluid vaporization temperature decreases improving cooling efficiency, but additional equipment is required for vacuum maintenance
Solution Approach 1:
The patent fundamentally changes the pressure parameter within the sealed enclosure by maintaining a vacuum environment. This pressure reduction directly lowers the vaporization temperature of the dielectric fluid, enabling more efficient heat absorption from computing components at lower temperatures. The vacuum condition optimizes the thermodynamic properties of the cooling fluid without requiring additional active cooling equipment
Solution Approach 2:
The patent combines multiple functions into integrated components: the vacuum pump serves both to create and maintain the vacuum environment and to act as part of the vapor management system by condensing and removing dielectric fluid vapors. The sealed enclosure integrates structural support, thermal insulation, and pressure containment functions, reducing overall equipment requirements while achieving lower vaporization temperatures
4Loss of energy
If the dielectric fluid is allowed to vaporize and condense continuously, then heat removal efficiency increases, but the fluid purity may deteriorate over time
Solution Approach 1:
The patent extracts and removes dielectric fluid vapors from the enclosure atmosphere through a vapor management system that selectively condenses and evacuates vapors while leaving non-condensable gases behind. This extraction process prevents vapor accumulation and potential fluid contamination, maintaining fluid purity over extended operational periods while continuously removing heat through the vaporization-condensation cycle
Solution Approach 2:
The patent implements a system that discards accumulated vapors and non-condensable gases from the enclosure through controlled evacuation, while recovering and condensing the dielectric fluid vapors back into liquid form for reuse. This recovery process maintains fluid quantity and quality by preventing contamination from repeated vaporization cycles, ensuring sustained heat removal efficiency without fluid degradation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables increased computing density and performance by maintaining components at stable low temperatures, reducing energy consumption, and minimizing the need for additional cooling infrastructure, while ensuring the dielectric fluid's purity and longevity.
Implementation Method 1
computer components and other electronics may be submerged in a dielectric or electrically non-conductive liquid in order to draw heat directly from the component into the liquid
Implementation Method 2
the temperature at which dielectric fluid vaporizes and the computing system operates
Implementation Method 3
convert gaseous dielectric fluid to liquid dielectric fluid
Implementation Method 4
a condensing system in order to cool and convert gaseous dielectric fluid to liquid dielectric fluid
Implementation Method 5
The disclosed pressure management system allows the disclosed embodiment to operate under a vacuum, thereby reducing the temperature at which dielectric fluid vaporizes
Data Source
AI summary
A two-phase liquid immersion cooling system is described in which heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. Advantageously an absorption/desorption unit is employed having a carbon element and a controller configured to regulate the absorption unit.