Immersion Plating Power Supply for Uniform Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional plating apparatuses face issues with uneven plating thickness and reduced filling performance in through-holes and via-holes due to the cathode power-supply roller being positioned outside the plating solution, leading to slower plating speeds and increased maintenance needs.
Innovation Solution
The apparatus incorporates an immersed cathode power-supply section within the plating tank, connected via short-circuit wiring to an auxiliary cathode power-supply section, ensuring continuous electricity supply to the plating surface, reducing the need for external power-supply points and minimizing substrate extraction, thus enhancing filling performance and uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the cathode power-supply roller is positioned outside the plating solution, then the plating apparatus structure is simpler, but the plating thickness becomes uneven and filling performance in through-holes and via-holes deteriorates
Solution Approach 1:
The power supply system transitions from an external roller configuration to an immersed cathode configuration within the plating tank. This dimensional change allows the power supply to be positioned inside the plating solution, enabling uniform current distribution across the substrate surface and improving plating thickness uniformity without significantly increasing overall structural complexity
Solution Approach 2:
The patent introduces an auxiliary cathode power-supply section connected by wiring to the main immersed cathode. This intermediary power supply component ensures continuous and stable electricity supply to the plating surface, preventing power interruptions that would cause uneven plating and improving overall manufacturing precision
2Ease of repair
If the cathode power-supply roller is positioned outside the plating solution, then maintenance is easier, but plating speed decreases and filling performance deteriorates
Solution Approach 1:
The immersed cathode configuration with auxiliary power supply sections ensures continuous electricity supply to the plating surface without interruptions. This continuous power delivery maintains high plating speed throughout the process, improving productivity while the modular power supply design keeps maintenance requirements manageable
Solution Approach 2:
The power supply system is designed to be self-regulating through the auxiliary cathode sections that automatically compensate for any power fluctuations. This self-service capability maintains stable plating speed and filling performance without requiring frequent external intervention or maintenance
3Length of stationary object
If the cathode power-supply roller is positioned outside the plating solution, then the plating tank can be shorter, but filling performance in through-holes and via-holes is reduced
Solution Approach 1:
By moving the power supply into the plating tank through the immersed cathode configuration, the system achieves better current distribution without requiring a longer tank. The auxiliary power supply sections are positioned strategically within the tank to optimize filling performance in through-holes and via-holes while maintaining compact overall dimensions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces maintenance requirements, shortens the plating tank length, and improves the uniformity and filling performance of plating within through-holes and via-holes, allowing for complete plating without substrate removal until completion.
Implementation Method 1
an apparatus configured to perform an electrolytic plating on a plating surface of a belt substrate
Data Source
AI summary
An apparatus that performs an electrolytic plating on a plating surface of a belt substrate is provided. The apparatus includes a plating tank, a conveyor device configured to carry a belt substrate through an interior of the plating tank, an immersed cathode power-supply section provided within the interior of the plating tank, an auxiliary cathode power-supply section provided within the interior of the plating tank, and short-circuit wiring configured to short-circuit the immersed cathode power-supply section to the auxiliary cathode power-supply section. A plating method for performing electrolytic plating on a plating surface of a belt substrate is provided. The method includes conveying the belt substrate through a plating tank, making the plating surface a cathode by contacting at least one of an immersed cathode power-supply section or an auxiliary cathode power-supply section with the belt substrate, and short-circuiting the immersed cathode power-supply section to the auxiliary cathode power-supply section.