Immersion Cooling Tank Piping With Variable-Area Inlets for Even Distribution

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Solution Overview

Problem

Current immersion cooling systems are not satisfactory in terms of cooling efficiency and fluid management, leading to inefficiencies and potential fluid waste.

Innovation Solution

The immersion cooling system incorporates a casing with a piping assembly featuring a fluid entrance, inflow branch pipes, and flow inlets with varying cross-sectional areas, a ring-shaped divider element to segregate fluid zones, and a design that ensures even fluid distribution to electronic devices, enhancing cooling efficiency and reducing waste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a conventional piping assembly with uniform flow inlet is used, then the structure is simple, but the fluid distribution is uneven leading to poor cooling efficiency

Engineering Contradiction:
Improvecooling efficiencyVSAvoidpiping assembly structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The flow inlet is designed with varying cross-sectional areas along its length, creating different flow resistance zones. The first cross-sectional area (A1) is smaller than the second cross-sectional area (A2), with the ratio A1:A2 being 1:2 to 1:3. This non-uniform structure optimizes fluid distribution locally at different positions, ensuring even cooling across electronic devices while maintaining acceptable structural complexity.

Inventive Principle:
Principle #3Local quality

2Productivity

If fluid flow rate is increased to improve cooling, then cooling efficiency improves, but fluid waste increases

Engineering Contradiction:
Improvecooling efficiencyVSAvoidfluid waste
Core Design Contradiction:
ProductivityVSLoss of substance

Solution Approach 1:

The flow inlet cross-sectional area parameters are specifically optimized with A1:A2 ratio of 1:2 to 1:3. This parameter optimization creates appropriate flow resistance that prevents excessive fluid flow while ensuring sufficient cooling, thereby improving cooling efficiency without proportionally increasing fluid consumption and waste.

Inventive Principle:
Principle #35Parameter changes

3Productivity

If multiple flow inlets are added to improve fluid distribution, then cooling efficiency improves, but device complexity increases

Engineering Contradiction:
Improvefluid distribution uniformityVSAvoidpiping assembly structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The piping assembly is segmented into multiple components: fluid entrance, inflow main pipe, inflow branch pipes, and flow inlets. This segmentation allows each component to perform its specific function optimally while maintaining overall system manageability and reducing complexity compared to a monolithic design.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of adding multiple flow inlets, the patent optimizes the local structure of each flow inlet by varying its cross-sectional area along the length. This local optimization achieves even fluid distribution without increasing the number of components, thereby improving cooling efficiency while controlling device complexity.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system improves cooling efficiency by ensuring even fluid distribution and temperature segregation, reducing fluid waste, and optimizing fluid circulation, thereby enhancing the cooling performance of electronic devices.

Implementation Method 1

The flow inlet includes an inconsistent cross-sectional-area portion and a consistent cross-sectional-area portion. The inconsistent cross-sectional-area portion is above the consistent cross-sectional-area portion. The inconsistent cross-sectional-area portion includes a first cross-sectional area and a second cross-sectional area, the first cross-sectional area is above the second cross-sectional area, and the first cross-sectional area is less than the second cross-sectional area.

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 2

Immersion cooling systems using fluid to cool electronic devices are flourishing.

Methodology Applied
Scientific EffectHeat transfer:

Implementation Method 3

The fluid entering and exiting the immersion cooling tank is extracted to the heat exchanger by the pump.

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20250311154A1Immersion cooling tank and immersion cooling system including the same
Publication Date: 2025.10.02 DELTA ELECTRONICS INC(CN)
  • US20250311154A1 patent drawing
  • US20250311154A1 patent drawing
  • US20250311154A1 patent drawing

AI summary

An immersion cooling tank is provided. The immersion cooling tank includes a casing and a piping assembly. The piping assembly includes a fluid entrance, an inflow branch pipe, and a flow inlet. The fluid entrance is provided on the casing. The inflow branch pipe is in fluid communication with the fluid entrance. The flow inlet is in fluid communication with the inflow branch pipe. The flow inlet protrudes from the top surface of the inflow branch pipe. Alternatively, the flow inlet is sunken relative to the top surface of the inflow branch pipe. The flow inlet includes a consistent cross-sectional-area portion and an inconsistent cross-sectional-area portion located above the consistent cross-sectional-area portion. The inconsistent cross-sectional-area portion includes a first cross-sectional area and a second cross-sectional area, the first cross-sectional area is above the second cross-sectional area, and the first cross-sectional area is less than the second cross-sectional area.