Impingement Cooling Substrate Layout for Compact Power Packages
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Solution Overview
Problem
Existing semiconductor packaging technologies either require a larger footprint or expensive systems to efficiently dissipate heat generated by high-speed and high-power electronic components.
Innovation Solution
A semiconductor system utilizing impingement cooling through a device substrate and a cooling substrate with similar thermal expansion coefficients, coupled via spacers, where coolant flows through vias to impinge on the device substrate, enhancing heat dissipation across the system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional cooling solutions are used to dissipate heat from high-power electronic components, then heat dissipation efficiency is improved, but the footprint area increases
Solution Approach 1:
The cooling substrate is positioned beneath the device substrate, nesting the cooling mechanism within the existing package structure. The coolant flows through channels in the cooling substrate, creating a compact layered arrangement that provides efficient heat dissipation without increasing the overall footprint area of the electronic component package.
Solution Approach 2:
The invention transitions from planar heat dissipation to three-dimensional heat management by introducing vertical cooling channels and a layered substrate structure. Heat is conducted vertically from the electronic component through the device substrate into the cooling substrate, utilizing the Z-dimension for heat transfer pathways rather than requiring expanded horizontal area.
2Loss of energy
If advanced cooling systems are implemented to dissipate heat effectively, then thermal management performance is improved, but system cost increases
Solution Approach 1:
The cooling substrate serves multiple functions: it acts as a heat sink, provides structural support, and enables coolant distribution through integrated channels. The device substrate also functions as both a mechanical platform and a thermal conduction path. This multi-functionality reduces the need for separate dedicated cooling components, thereby lowering overall system cost while maintaining effective thermal management.
Solution Approach 2:
The cooling channels are integrated directly into the cooling substrate structure, merging the fluid distribution function with the thermal conduction function. The spacers are incorporated as integral parts of the cooling substrate, combining mechanical support and thermal management features into a single manufactured component, reducing assembly steps and manufacturing complexity.
3Adaptability or versatility
If dissimilar materials are used in the substrate assembly, then manufacturing flexibility is improved, but thermal expansion mismatch causes reliability issues
Solution Approach 1:
The invention explicitly selects materials for the device substrate and cooling substrate that have compatible coefficients of thermal expansion. This ensures that during temperature cycling and operation, both substrates expand and contract at similar rates, preventing warping, delamination, or mechanical failure at the interface between layers, thereby maintaining long-term reliability of the assembled structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively dissipates heat from high-speed and high-power components, allowing them to operate efficiently while maintaining a compact footprint and affordable costs.
Implementation Method 1
a jet of coolant that is provided through a cooling substrate and impinges upon the device substrate
Implementation Method 2
the device substrate absorbs heat generated by the electronic components
Implementation Method 3
At least a portion of one or more of the device substrate and the cooling substrate have similar coefficients of thermal expansion
Data Source
AI summary
This application is directed to cooling a semiconductor system. The semiconductor system includes a device substrate having a first surface and a second surface, an electronic component thermally coupled to the device substrate, and a cooling substrate coupled to the device substrate. The cooling substrate includes a third surface facing the second surface of the device substrate, a fourth surface opposite the third surface, and a plurality of vias between the third and fourth surfaces. The second surface and the third surface define a cavity therebetween, such that in use coolant flows from the fourth surface through the plurality of vias to exit at the third surface, enters the cavity between the second and third surfaces, and impinges on the second surface. At least a portion of one or more of the device substrate and the cooling substrate have similar coefficients of thermal expansion.