Imprint Apparatus Gap Control for Replacement Gas Reduction
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Solution Overview
Problem
The high economic costs associated with the consumption of replacement gases in imprint apparatuses used for semiconductor manufacturing, which can lead to increased operational costs and inefficiencies due to the large amounts of gas consumed during the imprinting process.
Innovation Solution
An imprint apparatus with a gas supply unit, positioning unit, and controller that controls the gas supply and positioning to minimize gas consumption by adjusting the gap between the mold and substrate, ensuring a shorter second gap than the first gap during the relative position change, thereby reducing gas usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If replacement gas is supplied to fill spaces between mold and substrate during imprinting, then air bubbles are minimized and pattern defects are reduced, but the amount of replacement gas consumed increases operational costs
Solution Approach 1:
The gas supply unit supplies replacement gas to the space between the mold and substrate before the imprinting process begins. This preliminary gas supply ensures that air is displaced from the space, preventing air bubble formation during imprinting. By performing the gas supply action in advance, the patent reduces the need for excessive gas consumption during the actual imprinting process, thereby resolving the contradiction between pattern quality and gas consumption.
Solution Approach 2:
The positioning unit dynamically adjusts the gap between the mold and substrate during the imprinting process. By optimizing the gap distance, the patent ensures sufficient space for replacement gas to enter and displace air, while minimizing the overall volume of gas required. This dynamic adjustment allows the system to maintain high pattern quality with reduced gas consumption compared to fixed gap approaches.
2Reliability
If large amount of replacement gas is supplied to prevent air entry during mold releasing, then air bubbles are minimized, but operational costs increase
Solution Approach 1:
The gas supply unit continues to supply replacement gas to the space between the mold and substrate before the mold releasing process begins. This ensures that the space is already filled with replacement gas, preventing air from entering during mold releasing. By performing this gas supply action in advance, the patent eliminates the need to supply large amounts of gas during the actual releasing process, thereby maintaining high reliability with reduced gas consumption.
3Manufacturing precision
If gas supply is maintained during position change from first shot region to second shot region, then air bubbles are prevented, but gas consumption increases
Solution Approach 1:
The positioning unit adjusts the gap between the mold and substrate during movement from the first shot region to the second shot region. By dynamically optimizing the gap distance, the patent maintains sufficient replacement gas concentration to prevent air bubble formation, while minimizing the volume of gas required compared to maintaining a constant large gap throughout the process.
Solution Approach 2:
The replacement gas that remains in the space between the mold and substrate after the first imprinting process serves the dual purpose of preventing air bubbles during both the position change and the subsequent second imprinting process. This self-service approach eliminates the need for additional gas supply during the position change, thereby reducing overall gas consumption while maintaining pattern quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the consumption of replacement gases, lowering operational costs and improving productivity by efficiently managing gas supply and positioning to minimize defects and enhance pattern quality.
Implementation Method 1
a gas supply unit configured to supply a gas to a space between the mold and the substrate
Implementation Method 2
a positioning unit configured to change a gap between the mold and the substrate
Data Source
AI summary
Provided is an apparatus which is advantageous in view of reduction of consumption of a replacement gas. An apparatus for forming a pattern on a substrate using a mold includes a gas supply unit, a positioning unit and a controller. The controller controls a gas supply unit and a positioning unit and, causes second contact between a second shot region different from a first shot region and the mold after first contact between a first shot region having a material supplied thereon among the plurality of shot regions and the mold and controls the positioning unit so that a second gap which is the distance at the time of changing a relative position between the mold and the substrate in a surface direction from the first shot region to the second shot region is shorter than a first gap which is the distance at the time of gas supply.