Imprint Layer Contact Hole Formation for Touch Panel Conductive Layers
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Solution Overview
Problem
Conventional methods for producing touch panels face difficulties in achieving a direct electrical connection between conductive layers, requiring additional components and potentially damaging imprint blocks due to the need for pins to form contact holes.
Innovation Solution
A method involving the formation of an imprint layer with a contact hole overlapping a conductive layer, followed by a conductive layer forming groove that communicates with the contact hole, allowing for direct electrical connection of the conductive layer to the foundation conductive layer, eliminating the need for intermediate connection members and reducing the risk of imprint block damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If contact holes are formed using pins on the imprint block, then direct electrical connection between conductive layers is achieved, but the imprint block is prone to damage
Solution Approach 1:
The patent extracts the pin structure from the imprint block and replaces it with a separate mold structure that has protrusions. This removes the harmful element (pins that can break) while maintaining the useful function (forming contact holes for electrical connection). The protrusions on the mold form contact holes without requiring fragile pins embedded in the imprint block.
Solution Approach 2:
The patent introduces a mold as an intermediary tool between the imprint block and the substrate. The mold with its protrusions serves as a mediator that forms contact holes without damaging the imprint block. This intermediary structure enables the electrical connection function while protecting the imprint block from damage.
2Reliability
If additional connection members are used to connect conductive layers, then electrical connection is achieved, but the device structure becomes more complex
Solution Approach 1:
The patent merges the contact hole formation function with the conductive layer formation process. The mold protrusions simultaneously create the contact holes and define where the conductive material should be deposited. This integration eliminates the need for separate connection members and simplifies the overall structure while ensuring reliable electrical connection.
Solution Approach 2:
The mold structure serves multiple functions: it forms the contact holes, defines the conductive layer pattern, and ensures proper alignment. This multi-functional approach replaces what would otherwise require multiple separate components, reducing structural complexity while maintaining connection reliability.
3Ease of manufacture
If conventional imprint technique is used to form grooves, then groove formation is achieved, but direct electrical connection between stacked conductive layers cannot be established
Solution Approach 1:
The patent segments the groove formation process into two parts: the imprint layer forms the groove structure, while the mold protrusions create the contact holes that penetrate through the imprint layer. This segmentation allows the groove to be formed for easy manufacturing while simultaneously creating the through-contact holes needed for direct electrical connection between stacked conductive layers.
Solution Approach 2:
The patent adds the vertical dimension to the contact hole formation by creating holes that penetrate through the imprint layer thickness. The mold protrusions extend into the imprint layer to create these through-holes, enabling electrical connection in the vertical dimension while the groove provides the horizontal structure for conductor placement.
Data Source
AI summary
A method of producing a substrate includes an imprint layer forming step of forming an imprint layer on a surface of a foundation layer and boring a contact hole through a location in the imprint layer that overlaps at least a part of a foundation conductive layer of the foundation layer, a groove forming step of, by partially depressing a surface of the imprint layer, forming a conductive layer forming groove at least a part of which communicates with the contact hole, and a conductive layer forming step of forming a conductive layer in the conductive layer forming groove and the contact hole.