Imprint Structure Dimension Reduction via Polymer Vaporization
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Solution Overview
Problem
Current methods for patterning in the nanoscale range, such as nanoimprint lithography, face challenges including high costs, low throughput, and defects due to the need for expensive equipment and elaborate lithographic processes, particularly for creating molds with nanoscale features.
Innovation Solution
A method involving a substrate with an inorganic-organic compound comprising an inorganic moiety and a polymer moiety, where the polymer moiety has a lower vaporization temperature than the inorganic moiety, allowing for selective removal of the polymer to reduce the dimension of the imprint structure without the need for molds with nanoscale features, thereby reducing production costs and avoiding etching defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional photolithography is used for patterns larger than 100 nm, then manufacturing cost is low, but manufacturing precision deteriorates for nanoscale features
Solution Approach 1:
The patent replaces conventional photolithography (optical system) with a mechanical imprinting system. A mold with predefined patterns is physically pressed into a polymer coating under controlled pressure and temperature, transferring the pattern directly without requiring optical projection systems. This mechanical approach enables nanoscale precision while avoiding the high costs associated with electron beam lithography and other advanced nanoscale patterning methods.
Solution Approach 2:
The patent utilizes changes in the physical parameters of the polymer material, specifically transitioning it from a solid state to a molten state by heating above its glass transition temperature. This parameter change allows the polymer to flow and conform to the mold pattern, enabling precise pattern transfer. After imprinting, cooling the polymer returns it to a solid state, locking in the transferred pattern. This thermal parameter control enables cost-effective nanoscale patterning.
2Manufacturing precision
If electron beam lithography is used for nanoscale patterns, then manufacturing precision is high, but productivity is low and equipment cost is high
Solution Approach 1:
The patent employs preliminary action by pre-fabricating a mold with the desired nanoscale patterns using electron beam lithography or other high-precision methods. This mold is then reused multiple times for imprinting large areas with high throughput. The expensive high-precision step is performed only once to create the master mold, while subsequent production uses this mold for rapid, cost-effective pattern transfer, thereby achieving both high precision and high productivity.
Solution Approach 2:
The patent uses the mold as a physical copy or template of the desired pattern. The mold contains predefined topological patterns that are directly copied onto the polymer coating through contact imprinting. This copying approach allows rapid reproduction of nanoscale patterns across large substrate areas without requiring repeated exposure to expensive electron beam writing, thereby significantly increasing productivity while maintaining precision.
3Productivity
If NIL is used for patterning, then productivity is high and cost is low, but manufacturing precision deteriorates due to 1:1 pattern replication limitation
Solution Approach 1:
The patent introduces an intermediary material layer between the mold and the final pattern transfer. A thin layer of imprint resist (thermoplastic polymer) is spin-coated onto the substrate, and the mold is pressed into this polymer layer. The polymer acts as an intermediary that can be selectively removed after imprinting, allowing for dimension reduction and avoiding direct 1:1 replication limitations. This intermediary approach enables precise dimension control while maintaining high productivity.
4Manufacturing precision
If elaborate lithographic processes are used for mold fabrication, then manufacturing precision is high, but device complexity increases
Solution Approach 1:
The patent performs the complex high-precision lithographic process in advance to create the master mold, before the actual production imprinting process. The mold is fabricated once using electron beam lithography or other precision methods, and then this pre-prepared mold is used for rapid, simple contact imprinting of large areas. This preliminary action separates the complex precision step from the production step, reducing device complexity during manufacturing while maintaining high mold feature precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the dimension of imprint structures to the nanoscale range without requiring expensive molds, maintains the aspect ratio of the original structure, and avoids etching-related defects, enhancing throughput and operational efficiency.
Implementation Method 1
selectively removing at least part of the polymer moiety while enabling at least part of the inorganic moiety to form a substantially continuous inorganic phase in said imprint structure
Data Source
AI summary
A method of reducing the dimension of an imprint structure on a substrate, the method comprising the steps of:(a) providing a substrate having at least one imprint structure thereon, said structure being formed of an inorganic-organic compound comprising an inorganic moiety and a polymer moiety, said polymer moiety having a lower vaporization temperature than the melting point of said inorganic moiety; and(b) selectively removing at least part of the polymer moiety while enabling at least part of the inorganic moiety to form a substantially continuous inorganic phase in said imprint structure, wherein the removal of the at least part of the polymer moiety from the imprint structure reduces the dimension of the imprint structure.