Imprinting Apparatus Resin Distribution Interpolation
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Solution Overview
Problem
Existing imprinting technologies face challenges in accurately adjusting the application distribution of uncured resin material for each shot on a substrate, leading to variations in resin pattern accuracy due to environmental factors and difficulty in achieving uniformity across the substrate, resulting in low overall resin pattern accuracy.
Innovation Solution
An imprinting method and apparatus that interpolates and reinterpolates the application distribution of uncured resin material using shot layout information, considering relative positions, supply, and curing positions, to ensure precise application and curing, reducing user workload and improving pattern accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the application distribution of uncured resin material is adjusted based only on resin pattern height and surrounding environment, then the adjustment process is simple, but the adjustment result is insufficient and resin pattern accuracy remains low
Solution Approach 1:
The substrate is divided into multiple shots, and the application distribution is calculated and adjusted for each shot individually rather than uniformly across the entire substrate. This segmentation allows precise control of resin material application for each shot region, improving resin pattern accuracy while managing complexity through localized adjustments
Solution Approach 2:
The application distribution is optimized locally for each shot based on its specific position, resin pattern height requirements, and surrounding environment conditions. This local quality approach enables differentiated adjustment parameters for different shots, achieving high precision without requiring overly complex global adjustment mechanisms
2Manufacturing precision
If the application distribution is adjusted uniformly for all shots, then the adjustment process is efficient, but uniform shots cannot be formed due to varying state changes from center to periphery
Solution Approach 1:
The substrate processing is segmented into multiple shots with individual application distribution calculations. Each shot receives customized adjustment parameters based on its location and requirements, enabling uniform resin patterns across the entire substrate while maintaining efficient automated processing through program-controlled application
Solution Approach 2:
The application distribution parameters are dynamically adjusted for each shot based on position-dependent state changes of the uncured resin material. The system automatically modifies application conditions for different shots rather than using static uniform parameters, achieving resin pattern uniformity across the substrate while maintaining processing efficiency
3Manufacturing precision
If the application distribution is adjusted for each substrate individually, then the resin pattern accuracy for that substrate is improved, but the workload increases significantly
Solution Approach 1:
The application distribution parameters for multiple shots are pre-calculated and stored based on shot layout information, resin pattern requirements, and environmental factors. This preliminary calculation eliminates the need for time-consuming individual adjustments for each substrate, as the system can directly apply pre-determined optimized parameters
Solution Approach 2:
The application distribution calculation methodology is replicated and applied systematically across all shots using automated computation. Once the calculation model is established for one substrate, it can be efficiently copied and adapted for subsequent substrates with similar characteristics, reducing repetitive adjustment work while maintaining high precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for strict interpolation and efficient reinterpolation of the application distribution for each shot, significantly reducing workload and improving resin pattern accuracy by accounting for environmental and positional factors, leading to more uniform and precise resin patterns across the substrate.
Implementation Method 1
the state change, such as volatilization of an uncured resin material, may readily occur due to the influence of surrounding environment
Implementation Method 2
a resin pattern is formed by applying an uncured resin material to a substrate such as a silicon substrate (wafer), glass plate, or the like, and curing the uncured resin material
Data Source
AI summary
An imprinting method is capable of strictly interpolating application distribution of uncured resin material being applied to a substrate for each shot and interpolating application distribution of uncured resin material for each shot while reducing workload in a generation step. The imprinting apparatus includes a mold; a mold driving unit; a dispenser that applies uncured resin material to the substrate; a light source that cures uncured resin material as a pattern; a dispenser control unit that controls the dispenser by generating the application distribution of the uncured resin material to the resin pattern for each of a plurality of shots; and a main control unit that interpolates application distribution of uncured resin material, which has been generated by the dispenser control unit, using shot layout information of relative position among positions of a plurality of shots, the dispenser, and the light source with respect to the substrate, as variables.