Insulated Metal Substrate With Integrated Cooling Channels
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Solution Overview
Problem
Conventional cooling methods for high heat flux power devices face challenges in achieving uniform temperature distribution and efficient thermal management, with existing micro-channel and milli-channel technologies being complex and costly to manufacture.
Innovation Solution
A semiconductor power module utilizing an insulated metal substrate with integrated cooling fluid channels and a heatsink featuring a manifold array for coolant flow, which simplifies assembly and reduces costs while enhancing thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional liquid cooling plates are used, then heat flux capability is improved (up to 20 W/cm2), but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the substrate and heatsink into a single integrated IMS structure with cooling channels built directly into the metal base layer. This eliminates the need for separate cooling plates and complex backside micro-channel structures, reducing manufacturing steps while maintaining high heat flux capability through the integrated thermal pathways.
Solution Approach 2:
The patent transitions from conventional 2D cooling channel layouts to a 3D integrated structure where cooling channels are embedded within the substrate thickness. This vertical integration allows for more efficient thermal management by reducing thermal resistance pathways while simplifying the overall assembly architecture.
2Loss of energy
If micro-channel cooling designs are used, then heat flux capability is improved (up to 1000 W/cm2), but manufacturing complexity and cost increase significantly
Solution Approach 1:
The patent combines the substrate, cooling channels, and heatsink functions into a single IMS component. The cooling channels are formed as integral parts of the metal base layer through standard fabrication processes, eliminating the need for complex backside micro-channel structures and separate heatsink assemblies, thereby significantly reducing manufacturing complexity.
Solution Approach 2:
The IMS structure is designed to be self-cooling through integrated channels that require no external complex cooling infrastructure. The manifold array and plenums are built-in, allowing the substrate to serve its own thermal management needs without requiring separate complex cooling systems.
3Device complexity
If conventional cooling schemes are used, then simplicity is maintained, but thermal performance deteriorates (heat flux limited to 1-20 W/cm2)
Solution Approach 1:
The patent integrates cooling channels directly into the metal base layer of the IMS, creating a unified structure that combines substrate and cooling functions. This integration achieves high thermal performance by minimizing thermal resistance at interfaces while maintaining relative manufacturing simplicity through standard IMS fabrication processes.
Solution Approach 2:
The cooling channels are pre-formed as integral parts of the metal base layer during IMS manufacturing, before final assembly. This preliminary integration of thermal management pathways ensures optimal thermal performance from the outset while avoiding complex post-assembly cooling system installations.
4Loss of energy
If long cooling channels parallel to heated surface are used, then heat dissipation is achieved, but temperature uniformity deteriorates due to fluid temperature rise
Solution Approach 1:
The patent divides the cooling system into multiple short channel segments arranged in a grid pattern, with manifold arrays and plenums that create multiple flow paths. This segmentation reduces the length of individual channel segments, minimizing fluid temperature rise and improving temperature uniformity across the heated surface while maintaining effective heat dissipation.
Solution Approach 2:
The patent implements a grid array of cooling channels with manifold distribution systems that provide localized cooling throughout the substrate. This creates uniform cooling coverage by distributing coolant flow across multiple short pathways, ensuring consistent temperature distribution across the heated surface rather than concentrated cooling at single locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves higher thermal performance and electrical functionality by integrating cooling channels into the insulated metal substrate, reducing thermal resistance and improving heat dissipation capabilities compared to traditional methods.
Implementation Method 1
an insulated metal substrate (IMS) comprising a single cooling fluid channel or a plurality of cooling fluid channels integrated therein
Implementation Method 2
a heatsink mounted to the IMS, the heatsink comprising a manifold array configured to provide coolant flow through heatsink inlet and outlet plenums to cool the at least one semiconductor power device via the plurality of cooling fluid channels
Data Source
AI summary
A power module includes one or more semiconductor power devices bonded to an insulated metal substrate (IMS). A plurality of cooling fluid channels is integrated into the IMS.