IMS PCB Electrical Connection via Dielectric Hole
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Solution Overview
Problem
Existing insulated metal substrate (IMS) printed circuit boards require additional components for electrical connections between conductive layers, leading to increased costs and unreliable connections due to physical contact and potential oxidation.
Innovation Solution
The solution involves creating holes in the printed circuit board that traverse insulating layers to integrate electrically conductive material directly between the metallic substrate and conductive tracks, eliminating the need for additional components and ensuring a reliable connection through the use of solder paste or other conductive materials that adhere to both the tracks and substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If additional conductive elements (screws, springs, wires, foam) are used to provide electrical connection between conductive layers, then electrical connection is established, but production costs increase and connection reliability decreases
Solution Approach 1:
The patent merges the electrical connection function directly into the PCB structure by forming conductive tracks that extend through holes in the dielectric layer to contact pads on the metallic substrate. This eliminates the need for separate conductive elements (screws, springs, wires, foam) and integrates the connection function into the board itself, reducing component count and improving reliability.
Solution Approach 2:
The PCB structure itself provides the electrical connection function through its own conductive tracks and contact pads, without requiring external conductive elements. The board serves its own connection needs through the integrated conductive path formed during manufacturing, eliminating dependency on additional components that could fail.
2Reliability
If additional conductive elements are used to establish electrical connection, then electrical connection is achieved, but manufacturing costs increase
Solution Approach 1:
The electrical connection function is merged into the PCB manufacturing process itself. Conductive tracks are formed through holes in the dielectric layer and connected to contact pads on the metallic substrate during standard PCB fabrication, eliminating the need for separate components and reducing overall manufacturing cost.
Solution Approach 2:
The PCB structure provides its own electrical connection capability through integrated conductive tracks and contact pads, eliminating the need to purchase and install additional conductive elements. This self-service approach reduces component costs and assembly costs simultaneously.
3Ease of operation
If conductive elements rely on physical contact without adhesion, then assembly is simple, but connection stability decreases due to movement and oxidation
Solution Approach 1:
The conductive tracks are merged with the PCB structure and adhered to the metallic substrate contact pads through standard PCB fabrication processes. This integration ensures mechanical stability and electrical reliability, preventing disconnection from movement or oxidation while maintaining manufacturing simplicity.
Solution Approach 2:
The PCB structure itself provides the adhered connection through its conductive tracks and contact pads, eliminating the need for separate conductive elements that rely solely on physical contact. The integrated design ensures connection stability through the board's own structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method provides a cost-effective and reliable electrical connection between the metallic substrate and conductive tracks without additional components, enhancing connection stability and preventing disconnection during device operation or impact.
Implementation Method 1
The electrically conductive material is adhered to the electrically conductive layer, in particular to the track(s) which are to be electrically connected to the metallic substrate
Data Source
Figure 1A~1C
Figure 1D~1F
Figure 2A~2C
AI summary
Electrical device for a lighting device and method for producing thereof. The electrical device comprises: a printed circuit board comprising at least one electrically insulating layer, a metallic substrate, and an electrically conductive layer defining electrically conductive tracks, the at least one electrically insulating layer being sandwiched between the metallic substrate and the electrically conductive layer; the printed circuit board further comprises a hole at least traversing the at least one electrically insulating layer; and the printed circuit board further comprises an electrically conductive material having at least one part within the hole, the electrically conductive material being adhered to the electrically conductive layer so as to electrically connect at least one of the electrically conductive tracks to the metallic substrate.