Printed Circuit Grounding TRIZ Cases
- FPCB Grounding via Folded Substrate Stiffening
Folded flexible substrate provides rigid grounding contact without extra hardware.
- Wiring Substrate Radiator Side Surface Heat Dissipation
Side-exposed radiator heat dissipation section redirects thermal energy laterally, reducing internal substrate accumulation and improving uniformity.
- IMS PCB Electrical Connection via Dielectric Hole
Holes traverse insulating layers in IMS PCBs to integrate conductive material between tracks and the metallic substrate.
- Metallic Frame Antenna for 5G Signal Reception
A metallic frame with gaps receives 5G mobile signals without additional antenna structures.
- PCB Stitching Vias for Heat Radiation and EMI Shielding
Stitching vias penetrate the PCB base to conduct heat and block electromagnetic noise, resolving thermal and interference bottlenecks in multi-chip packages.