Wiring Substrate Radiator Side Surface Heat Dissipation
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Solution Overview
Problem
In modules with electronic components mounted on wiring substrates, heat generated by these components tends to accumulate inside the substrate due to the concentrated heat dissipation through thermal vias, affecting other components and requiring improved dissipation mechanisms.
Innovation Solution
A module design featuring a radiator with a heat dissipation section that is electrically insulated from the electronic component but in contact with it, and partially exposed to the side surface of the wiring substrate, allowing heat to be dissipated without the need for thermal vias through the substrate, and optionally including an electromagnetic shield for enhanced thermal conductivity and shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermal vias are provided passing through the wiring substrate immediately under the electronic component to dissipate heat, then heat dissipation from the electronic component is improved, but heat accumulates inside the wiring substrate
Solution Approach 1:
The patent transitions from conventional through-substrate heat dissipation to side-surface heat dissipation. The conductor extends from beneath the electronic component through the insulation layers to expose a heat dissipation section at the side surface of the wiring substrate, utilizing the lateral dimension for heat rejection rather than relying solely on vertical thermal vias.
Solution Approach 2:
The heat dissipation function is extracted from the interior of the wiring substrate and relocated to the side surface. By exposing the heat dissipation section at the side surface, the patent removes heat from the system at the boundary rather than allowing it to accumulate within the substrate volume.
2Temperature
If thermal vias are used for heat dissipation, then heat transfer from electronic component is improved, but the wiring substrate structure becomes more complex
Solution Approach 1:
The conductor serves multiple functions: it provides electrical connection beneath the electronic component and simultaneously acts as a heat dissipation path. By extending this conductor to the side surface, it also functions as a heat dissipation section, combining electrical and thermal management functions in a single structural element.
Solution Approach 2:
The patent merges the electrical connection function and heat dissipation function into a single conductor structure. The same conductor that provides electrical connectivity also serves as the heat dissipation path, eliminating the need for separate thermal via structures.
3Temperature
If heat dissipation paths are concentrated under the electronic component, then heat transfer from the component is improved, but heat distribution inside the substrate becomes uneven
Solution Approach 1:
The heat dissipation path is segmented into two functional zones: a heat collection section beneath the electronic component that gathers heat, and a heat dissipation section at the side surface that releases heat to the external environment. This segmentation creates a heat flow path that prevents concentration and promotes more uniform heat distribution within the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively dissipates heat from electronic components through the side surface of the substrate, reducing heat accumulation inside the module and improving thermal and shielding performance by utilizing high thermal conductivity materials and exposing the heat dissipation section to the substrate's side surface.
Implementation Method 1
the radiator includes a heat dissipation section formed of a passing-through conductor passing through at least one of the insulation layers
Implementation Method 2
a part of the heat dissipation section is exposed to a side surface of the wiring substrate
Implementation Method 3
a part of the heat dissipation section is exposed to a side surface of the wiring substrate
Data Source
AI summary
A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is mounted and in which a radiator 4 for dissipating heat generated from the electronic component 3 is provided. The radiator 4 includes a heat dissipation section 4a that is provided so that a part thereof is exposed to a side surface of the wiring substrate 2. In this case, because the heat dissipation section 4a is provided so that a part thereof is exposed to the side surface of the wiring substrate 2, the heat from the electronic component 3a can be dissipated through the side surface of the wiring substrate 2.