In-cell Touch Array Substrate Wiring Resistance Reduction

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Solution Overview

Problem

In self-capacitive in-cell touch screens, the resistance of connection wiring affects touch control sensitivity, and increasing the number of metal connection lines to reduce resistance also increases coupling capacitance, limiting sensitivity improvement.

Innovation Solution

The array substrate is redesigned with a first metal layer as a data line wiring layer, a second metal layer as a scan line wiring layer, and a third metal layer as a connection wiring layer for touch control inductive electrodes, with additional metal lines in the second metal layer connected in parallel to reduce wiring resistance without significantly increasing coupling capacitance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the number of metal connection lines is increased to reduce wiring resistance, then touch control sensitivity is improved, but coupling capacitance increases which limits sensitivity improvement

Engineering Contradiction:
Improvetouch control sensitivityVSAvoidcoupling capacitance
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a fourth metal layer to create a three-dimensional wiring structure. The connection wiring in the fourth metal layer is positioned directly below the touch control inductive electrode, forming a vertical connection path that reduces horizontal wiring length and resistance without increasing coupling capacitance with the electrode.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent introduces a fifth metal layer as an intermediary connection layer between the fourth metal layer and the touch control detection chip. This intermediary layer provides additional connection paths and allows optimization of the wiring structure without directly increasing coupling capacitance with the inductive electrode.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the width of metal connection line is increased to reduce resistance, then wiring resistance decreases, but aperture rate of display area is reduced

Engineering Contradiction:
Improvewiring resistanceVSAvoidaperture rate
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The patent transitions from two-dimensional planar wiring to three-dimensional stacked wiring by introducing fourth and fifth metal layers. This allows the use of thinner individual connection lines that maintain low resistance through vertical stacking, thereby preserving the aperture rate of the display area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Reliability

If multiple metal connection lines are connected in parallel to reduce resistance, then total wiring resistance decreases, but device complexity increases

Engineering Contradiction:
Improvetotal wiring resistanceVSAvoidnumber of metal connection lines
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent uses vertical stacking of metal layers to create parallel connection paths in the third dimension. The fourth metal layer provides direct vertical connections below each inductive electrode, and the fifth metal layer provides additional intermediary connections, achieving parallel resistance reduction through spatial stacking rather than increasing the number of lines in the same plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration reduces the resistance of connection wiring, enhancing touch control sensitivity without increasing coupling capacitance, thereby improving the overall touch control performance.

Implementation Method 1

a first metal layer, a second metal layer, a third metal layer and a common electrode layer that are sequentially formed on the glass substrate and are insulated with each other

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

a first insulating layer is disposed between the first metal layer and the second metal layer, a second insulating layer is disposed between the second metal layer and the third metal layer, and a third insulating layer is disposed between the third metal layer and the common electrode layer

Methodology Applied
Scientific EffectElectrical insulation: Conduction (electrical)

Implementation Method 3

when a human body does not touch the screen, a capacitance value born by each self capacitive electrode is a fixed value, and when the human body touches the screen, a capacitance born by the self capacitive electrode corresponding to the touch position is a sum of a fixed value and a human body capacitance

Methodology Applied
Scientific EffectCapacitance: Capacitance

Data Source

PatentUS10108063B2In-cell touch liquid crystal panel and array substrate thereof
Publication Date: 2018.10.23 WUHAN CHINA STAR OPTOELECTRONICS TECH CO LTD
  • US10108063B2 patent drawing
  • US10108063B2 patent drawing
  • US10108063B2 patent drawing

AI summary

An in-cell touch liquid crystal panel and an array substrate thereof, and the array substrate includes a glass substrate and three metal layers, and a common electrode layer that are sequentially formed on the glass substrate and are insulated with each other. A plurality of scan lines are disposed in the second metal layer, a plurality of connection wirings are disposed in the third metal layer, and a common electrode layer is divided into a plurality of touch control inductive electrodes that are electrically connected to a touch control detection chip through the connection wirings. A plurality of metal lines are disposed in the second metal layer, the metal lines and the scan lines are insulated with each other, and two ends of each metal line are electrically connected to the connection wiring.