In-Vessel Ion Focusing and Sorting for Low-Damage Plasma Processing

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Solution Overview

Problem

Existing plasma processing apparatuses face challenges in downsizing while minimizing substrate damage, as the ion source components occupy significant space outside the processing vessel, making it difficult to scale down the apparatus while reducing substrate damage.

Innovation Solution

The plasma processing apparatus incorporates a processing vessel with a focusing device and a sorting device inside the vessel to focus and sort specific ions, eliminating the need for external ion source components, thereby reducing the overall size and minimizing substrate damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If an ion source is provided outside the processing vessel to sort out specific ions, then substrate damage is reduced, but the apparatus size increases

Engineering Contradiction:
Improvesubstrate damageVSAvoidapparatus size
Core Design Contradiction:
Object-affected harmful factorsVSArea of stationary object

Solution Approach 1:

The patent merges the ion source, focusing device, and sorting device into a single integrated unit located inside the processing vessel. This combination eliminates the need for separate external ion source components and connecting pipes, thereby reducing the overall apparatus size while maintaining the capability to sort out specific ions and reduce substrate damage.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a nested configuration where the ion source is positioned inside the processing vessel, and the focusing device and sorting device are arranged within the same space. This nesting approach allows multiple functional components to occupy overlapping or adjacent spatial regions, significantly reducing the external footprint of the apparatus while preserving all necessary functions for ion generation, focusing, and sorting.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Reliability

If ion source components are placed outside the processing vessel, then ion sorting capability is maintained, but the apparatus becomes larger and more complex

Engineering Contradiction:
Improveion sorting capabilityVSAvoidapparatus complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent combines the ion source, focusing device, and sorting device into one integrated system located inside the processing vessel. This merger reduces the number of separate components and connections required, thereby simplifying the overall apparatus structure while maintaining reliable ion sorting capability through the coordinated operation of the integrated components.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated ion source assembly serves multiple functions simultaneously: generating plasma, focusing ions, and sorting specific ion types. This multi-functionality is achieved by arranging the ion source, focusing device, and sorting device in close proximity within the processing vessel, allowing a single integrated structure to perform what previously required separate external components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Measurement precision

If external pipes and electromagnets are used for ion sorting, then specific ion selection is achieved, but the apparatus occupies more space

Engineering Contradiction:
Improveion selection precisionVSAvoidapparatus volume
Core Design Contradiction:
Measurement precisionVSVolume of stationary object

Solution Approach 1:

The patent integrates the electromagnet and sorting functionality directly into the ion source assembly inside the processing vessel. This merging eliminates the need for separate external pipes and electromagnets, reducing the apparatus volume while maintaining precise ion selection capability through the compact integrated sorting structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent rearranges the ion sorting components from an external linear configuration to an internal three-dimensional arrangement within the processing vessel. By utilizing vertical and radial space within the vessel, the electromagnet and sorting structures are positioned to achieve precise ion selection without requiring additional external horizontal space, effectively transitioning from a two-dimensional external layout to a three-dimensional internal configuration.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for reduced substrate damage by selectively supplying ions with uniform energy and high chemical reactivity while downsizing the apparatus by eliminating external ion source components, achieving efficient plasma processing with improved precision.

Implementation Method 1

a plasma forming device configured to form plasma within the processing vessel

Methodology Applied
Scientific EffectPlasma: Plasma

Implementation Method 2

a focusing device disposed within the processing vessel, and configured to focus multiple ions in the plasma to output an ion beam

Methodology Applied
Scientific EffectElectromagnetic focusing: Electromagnet

Implementation Method 3

a sorting device configured to sort out, from the ion beam outputted from the focusing device, a specific ion to be supplied to the substrate

Methodology Applied
Scientific EffectElectromagnetic deflection: Lorentz Force

Data Source

PatentUS20230386801A1Plasma processing apparatus
Publication Date: 2023.11.30 TOKYO ELECTRON LTD
  • US20230386801A1 patent drawing
  • US20230386801A1 patent drawing
  • US20230386801A1 patent drawing

AI summary

A plasma processing apparatus includes a processing vessel in which a substrate as a target of a plasma processing is disposed; a plasma forming device configured to form plasma within the processing vessel; a focusing device disposed within the processing vessel, and configured to focus multiple ions in the plasma to output an ion beam; and a sorting device configured to sort out, from the ion beam outputted from the focusing device, a specific ion to be supplied to the substrate.