Inclined Alignment Core for Optical Circuit Board Active Alignment
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Solution Overview
Problem
Existing optical circuit boards face challenges in achieving high accuracy active alignment for mounting optical components like silicon photonics devices due to the proximity of alignment core end surfaces to the wiring board surface, hindering efficient light transmission and reception for alignment.
Innovation Solution
The optical circuit board features an optical waveguide with an inclined first end surface of the alignment core relative to the wiring board surface, allowing for effective light transmission and reception, and a manufacturing method involving a lower cladding layer, signal core, alignment cores, and an upper cladding layer to facilitate accurate active alignment and optical waveguide formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the alignment core end surface is positioned close to the wiring board surface, then the structure is compact, but light transmission and reception for alignment becomes inefficient
Solution Approach 1:
The alignment core end surface is inclined relative to the upper surface of the wiring board, creating a dimensional change from a flat surface to an angled surface. This inclination allows light to be transmitted and received more effectively for alignment purposes while maintaining the compact structure, as the angled surface provides a better interface for optical coupling without increasing the overall footprint of the device.
2Measurement precision
If the alignment core end surface is inclined relative to the wiring board surface, then active alignment accuracy is improved, but manufacturing complexity increases
Solution Approach 1:
The inclination of the alignment core end surface is built into the waveguide structure during the manufacturing process, before the actual assembly and alignment operations. This preliminary formation of the inclined surface ensures that the alignment geometry is pre-established, allowing for high-precision active alignment while avoiding the need for complex post-manufacturing adjustments or specialized alignment equipment.
3Ease of manufacture
If the signal core is removed from the upper surface of the solder resist, then optical waveguide continuity inspection is simplified, but the structural integrity may be compromised
Solution Approach 1:
The signal core material is selectively removed from the upper surface of the solder resist in the inspection region, extracting only the portion needed for optical continuity inspection. This removal allows inspection equipment to access and verify the optical waveguide continuity without being obstructed by the solder resist or signal core material, while the underlying waveguide structure and cladding layers remain intact to maintain structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables high-accuracy mounting of optical components and simplifies optical waveguide continuity inspection, ensuring efficient signal transmission and reception, thereby improving the active alignment process.
Implementation Method 1
the first end surface is inclined relative to the upper surface of the wiring board... allowing for effective light transmission and reception
Data Source
AI summary
An optical circuit board includes a wiring board and an optical waveguide. The wiring board includes an upper surface including a mounting region for an optical component. The optical waveguide is located adjacent to the mounting region for the optical component on the wiring board and includes a lower cladding layer, a plurality of cores including a signal core and alignment cores sandwiching the signal core, and an upper cladding layer in order from an upper surface of the wiring board. The alignment core includes a first end surface proximate to the mounting region for the optical component, and the first end surface is inclined relative to the upper surface of the wiring board.