Circuit Optical Details TRIZ Cases

A hybrid interconnect system transmits optical signals through air-filled trenches in a printed circuit board substrate to boost bandwidth.

This photosensitive epoxy resin composition balances molecular weight parameters to maintain film flexibility while achieving high patterning resolution and reflow resistance.

Relief cuts on the PCB edge receive the light guide assembly, allowing lens extension to eliminate mechanical interference and prevent optical misalignment.

Segmenting vias into optical and electrical types prevents metal pads from blocking light paths while maintaining reliable connections.

A transparent blank package mimics component pads to enable visual inspection of printed circuit board surfaces during assembly.

Optical fiber wrapping patterns shape acoustic sensor frequency response for precise sensitivity control.

Pressing a photocurable resin sheet with an inclined die creates smooth mirror faces, eliminating cutting debris and reducing optical loss.

A capacitive touch sensor substrate integrates a phase difference film to enable operation through polarized sunglasses.

Perpendicular wiring traversal maintains consistent cross-sectional shape across stepped insulation resin layers.

Colloid encapsulation prevents wire disconnection and light reflection onto the photosensitive chip, improving image quality.

A photoelectric composite board method uses a reference mark to define electrode pad coordinates on solder resist layers.

Optical waveguide core part protrudes beyond insulating layer surface to enhance optical coupling efficiency.

A multi-layer electrode structure uses two-dimensional conductive materials to achieve improved flexibility and reduced sheet resistance.

An optical waveguide uses an outer cladding layer with a lower refractive index than the core to reflect light at an inclined surface.

A transparent conductive layer with varying thickness grounds static charges to eliminate poor blanking and improve touch sensitivity.

An optical circuit board uses an inclined alignment core end surface to enable effective light transmission and reception during component mounting.

Folded substrate surfaces orient LEDs to emit light directionally without extra lenses.

A photoelectric composite circuit board integrates optical fibers into insulating layers to enable high-speed data transmission between chips and components.

A segmented optical sensor array eliminates mechanical scanning complexity while maintaining high measurement precision across the display surface.

Stacked circuit board layers contact the housing to dissipate heat from light emitting chips.

Getter-doped matching layers shield conductive silver from oxidation, enabling high specific heating power and optical neutrality without blocking layers.

Countersunk holes house LEDs and diffuse light via reflective inner walls.

Reflective and diffusion patterns on an integrated sheet redirect LED light to eliminate hot spots and ensure uniform brightness across the display panel.

Glass or silicon mirror supports reduce transmission loss by ensuring accurate inclined surface angles.

Expansion joints with compliant material absorb thermal expansion stress, preventing cracking and refractive index variations in electro-optical circuit boards.