Transparent PCB Test Package for Cleaning Inspection
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Solution Overview
Problem
Traditional cleaning processes for electronic circuitry on printed circuit boards often fail to adequately remove residual solder, solder paste, and flux, especially from leadless component packages, as the connections are hidden and difficult to inspect.
Innovation Solution
A transparent blank package is used that mimics the electronic component packages, allowing for visual inspection of the printed circuit board during the electrical connection and cleaning processes. The blank package has a body made from transparent material with conductive pads matching the actual component packages, enabling the observation of any debris or residue underneath.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional opaque component packages are used, then the package structure is simple and manufacturing is easy, but the cleaning quality cannot be evaluated because connections are hidden from view
Solution Approach 1:
The patent uses a transparent replica package that copies the external dimensions, conductive pad layout, and mounting footprint of the actual electronic component package. This transparent copy allows visual inspection of the PCB surface beneath while maintaining identical electrical connection characteristics, enabling cleaning quality evaluation without altering the actual functional package design.
Solution Approach 2:
The patent employs transparent or translucent materials for the replica package body, changing the optical property from opaque to transparent. This material property change enables light transmission through the package body, making previously hidden PCB surfaces and cleaning residues visible for inspection.
2Measurement precision
If transparent material is used for the package body, then visual inspection of cleaning quality is enabled, but the material selection becomes more restricted
Solution Approach 1:
The patent changes the optical parameter (transparency) of the package body material while maintaining other critical parameters such as mechanical strength, thermal stability, and electrical insulation properties. Common transparent materials like transparent epoxy resin, glass, or transparent plastic can be used to achieve this parameter change without significantly complicating the manufacturing process.
3Measurement precision
If the blank package mimics the actual component package, then accurate visual inspection is possible, but the manufacturing process becomes more complex
Solution Approach 1:
The replica package manufacturing can be segmented into separate stages: first creating the transparent body, then adding conductive pads, and finally mounting it on the PCB. This segmentation allows each component to be manufactured using standard processes, reducing overall manufacturing complexity while achieving accurate mimicry of the actual package.
Solution Approach 2:
Instead of manufacturing a completely new complex structure, the patent copies the essential features (dimensions, pad layout, footprint) of the actual package onto a simple transparent body. This copying approach leverages existing design data and standard manufacturing processes, avoiding the need for complex new fabrication methods.
Data Source
AI summary
A blank package for mimicking an electronic component package comprises a body and a plurality of conductive pads. The body is formed from generally transparent electrically insulating material and has a top surface, a bottom surface, and a plurality of side surfaces. The bottom surface has a shape and dimensions that are similar to a bottom surface of the electronic component package. The conductive pads are formed from electrically conductive material and attached to the body, with each conductive pad corresponding to a successive one of the conductive pads of the electronic component package. Each conductive pad has features that are similar to features of the corresponding conductive pad of the electronic component package.