Lens Module Colloid Encapsulation for Wire Reliability
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Solution Overview
Problem
In lens modules of mobile phones, long metal wires can cause disconnection or contact issues, leading to poor electrical performance, and may reflect light onto the photosensitive chip, affecting image quality, especially in bright environments.
Innovation Solution
A method of assembling the lens module involves mounting gold fingers on the circuit board, coupling metal wires to these fingers, and encapsulating them with a colloid to prevent contact and light reflection, enhancing electrical performance and image quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If long metal wires are used to couple the photosensitive chip to the circuit board, then electrical connection is achieved, but disconnection or contact between wires occurs resulting in poor electrical performance
Solution Approach 1:
The patent introduces a colloid encapsulation material as an intermediary substance that fills the space around and between metal wires. This colloid acts as a mediator that prevents wire disconnection and eliminates contact between adjacent wires by providing mechanical support and electrical insulation, thereby improving reliability without requiring shorter wires
Solution Approach 2:
The patent applies a colloid encapsulation layer that forms a protective flexible shell around the metal wires and photosensitive chip assembly. This encapsulation layer provides mechanical protection, prevents wire disconnection, and eliminates light reflection issues while maintaining the necessary wire length for electrical connections
2Reliability
If long metal wires are used for electrical connection, then connectivity is established, but light reflection onto the photosensitive chip affects image quality
Solution Approach 1:
The colloid encapsulation material serves as an optical intermediary that prevents light from reflecting off the metal wires onto the photosensitive chip. The colloid's optical properties absorb or scatter stray light, eliminating the harmful reflection effect while allowing the metal wires to maintain their necessary length for electrical connectivity
Solution Approach 2:
The patent converts the potentially harmful light reflection from metal wires into a beneficial situation by using the colloid encapsulation to absorb the reflected light. The colloid transforms the harmful reflection into trapped or scattered light that does not reach the photosensitive chip, thereby improving image quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents metal wire disconnection and light reflection, improving the electrical performance and image quality of the lens module by ensuring reliable connections and reducing optical interference.
Implementation Method 1
light may pass through the filter and reflect off the metal wires onto the photosensitive chip
Data Source
AI summary
A lens module includes a circuit board, a photosensitive chip, a mounting bracket, a filter, a lens base, and a lens. The circuit board defines a first through hole. The photosensitive chip is mounted within the first through hole. Gold fingers are mounted on the circuit board surrounding the photosensitive chip. Metal wires are mounted on a periphery of the photosensitive chip. Each of the metal wires is coupled to a corresponding one of the gold fingers. The metal wires are encapsulated by a colloid so that the metal wires do not contact each other. The mounting bracket is mounted on the circuit board. The filter is mounted on the mounting bracket and aligned with the photosensitive chip. The lens base is mounted on the mounting bracket. The lens is mounted within the lens base and aligned with the photosensitive chip.