Semiconductor Optical Via With Segmented Metal Layers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing optical modules face challenges in seamlessly integrating optical connections between components without interrupting the optical path with metal pads, which hampers efficient light transfer and signal propagation.
Innovation Solution
A semiconductor device with an optical via that features a metal via layer surrounding the optical path as a hollow cylinder, allowing uninterrupted light transmission, and through-substrate vias for electrical connections, along with dielectric layers and optional zone plates or grating couplers for enhanced light management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional through-substrate via with metal landing pad is used, then electrical connection is achieved, but the optical path is interrupted by the metal pad
Solution Approach 1:
The via structure is segmented into two distinct types: optical vias without metal landing pads to maintain optical path continuity, and electrical vias with metal landing pads for electrical connections. This segmentation allows each via type to optimize its specific function without compromising the other.
Solution Approach 2:
Different regions of the substrate are assigned different via types based on local requirements: optical vias in regions requiring light transmission and electrical vias in regions requiring electrical connections. The metal landing pads are locally applied only where electrical connections are needed, not throughout the entire via structure.
2Reliability
If metal landing pads are added to optical vias, then electrical contact is improved, but light transmission is blocked
Solution Approach 1:
The via structure is segmented into two distinct types: optical vias without metal landing pads to maintain optical path continuity, and electrical vias with metal landing pads for electrical connections. This segmentation allows each via type to optimize its specific function without compromising the other.
Solution Approach 2:
Separate via structures serve as intermediaries for different functions: optical vias mediate light transmission without metal obstruction, while electrical vias mediate electrical connections with metal landing pads. This intermediary approach allows independent optimization of optical and electrical pathways.
3Manufacturing precision
If additional etching steps are implemented for optical vias, then optical path quality is improved, but manufacturing complexity increases
Solution Approach 1:
The formation of optical vias and electrical vias is merged into a single etching process step. Both via types are created simultaneously using the same etching methodology, eliminating the need for separate etching steps and reducing manufacturing complexity while maintaining optical path quality.
Solution Approach 2:
A universal via formation process is developed that can create both optical vias and electrical vias using the same etching steps. This multi-functional approach simplifies the manufacturing process by consolidating what could have been separate specialized processes into a single unified procedure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient light signal transfer and optical connectivity between components without additional etching steps, leveraging conventional production techniques and surface plasmon-polaritons for improved light propagation.
Implementation Method 1
leveraging conventional production techniques and surface plasmon-polaritons for improved light propagation
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The semiconductor device comprises a semiconductor substrate (1) and an optical via (4) penetrating the substrate from a main surface (12) to an opposite further main surface (13). A metal via layer (5) is arranged along the optical via without closing the optical via. A contact pad (19) is arranged above the further main surface at a distance from the optical via. A through-substrate via (14) comprising a further metal via layer (15) is arranged in the substrate, the through-substrate via penetrating the substrate from the main surface to the contact pad. The further metal via layer is in electrical contact with the contact pad.