Optical Module Stacked PCB Heat Dissipation
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Solution Overview
Problem
Optical modules face challenges with poor heat dissipation and inefficient space utilization due to limited heat dissipation channels and compact housing designs, which affect the performance of chips within these modules.
Innovation Solution
The implementation of three circuit board layers in an optical module, where the layers are in contact with the housing for enhanced heat dissipation and vertically superposed to expand available space, providing multiple heat dissipation channels and improved chip heat management through lug bosses or heat conductive structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If chips are mounted on a PCB in a compact housing, then space utilization is improved, but heat dissipation deteriorates
Solution Approach 1:
The patent transitions from a traditional planar PCB layout to a three-dimensional stacked architecture with multiple circuit board layers arranged vertically. This dimensional change allows heat to dissipate through multiple vertical pathways to the housing, effectively resolving the heat dissipation problem while maintaining compact horizontal footprint and high space utilization.
Solution Approach 2:
The patent divides the single PCB into multiple separate circuit board layers that are stacked vertically. Each layer can independently contact the housing at different locations, creating multiple segmented heat dissipation channels. This segmentation allows heat from chips on different layers to be conducted to various points on the housing simultaneously, improving overall heat dissipation efficiency.
2Temperature
If multiple circuit board layers are stacked vertically, then heat dissipation channels are increased, but device complexity increases
Solution Approach 1:
The patent combines multiple circuit board layers into a single integrated stacked assembly that functions as one unified structure. The layers are mechanically and electrically integrated through standardized interconnections, allowing the complex multi-layer system to be treated and manufactured as a single module, thereby reducing overall device complexity despite the increased number of layers.
Solution Approach 2:
The circuit board layers are designed with universal mounting features and standardized interfaces that allow them to perform multiple functions: electrical interconnection between layers, mechanical support for chips, and heat conduction to the housing. This multi-functionality reduces the need for separate dedicated components, simplifying the overall device structure despite the vertical stacking complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances heat dissipation for light emitting chips and improves overall space utilization within the optical module, allowing for more efficient heat management and increased chip density.
Implementation Method 1
the circuit board layers may be disposed to be in contact with a housing of the optical module to improve heat dissipation
Implementation Method 2
A light emitting chip may be disposed to be in contact with a lug boss or a heat conductive structure to improve heat dissipation
Data Source
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AI summary
An optical module is provided in the present disclosure. According to an embodiment, the optical module may comprise a housing (upper housing 111 and lower housing 112), two or more circuit board layers 121, 122, 123, and a light emitting chip (not shown in the figure). The two or more circuit board layers may be disposed in the housing and electrically connected to each other; and the light emitting chip may be electrically connected to at least one of the circuit board layers.