Optical Integrated Device With Inclined Chip Interfaces for Butt Coupling
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Solution Overview
Problem
The high-precision alignment work required for optical waveguides with electro-optic effects, such as TF-LN waveguides, increases the workload in optical integrated devices, and the large gap between optical waveguides reduces optical coupling efficiency.
Innovation Solution
The optical integrated device incorporates a first chip with a step portion and a second chip mounted on it, featuring inclined surfaces for optical connection, reducing the need for separate components like PR and PBC, and minimizing gaps for improved coupling efficiency through butt coupling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-precision alignment work is performed for optical waveguides with electro-optic effects, then optical coupling efficiency is improved, but workload and device complexity increase
Solution Approach 1:
The patent introduces a step portion as an intermediary structure between the first chip (optical waveguide chip) and the second chip (electro-optic effect chip). This step portion serves as a mediator that facilitates optical coupling while reducing the alignment workload. The step portion includes a first inclined surface that abuts against a second inclined surface, creating a self-aligning mechanism that reduces the precision requirements for manual alignment work.
Solution Approach 2:
The patent utilizes the vertical dimension by creating a step portion with inclined surfaces rather than relying solely on horizontal alignment. The first inclined surface and second inclined surface form an abutting relationship that constrains the position of the second chip in the vertical and horizontal directions simultaneously. This dimensional approach transforms a 2D alignment problem into a 3D self-aligning structure, reducing the complexity of alignment work.
2Ease of manufacture
If large gaps are maintained between optical waveguides, then ease of assembly is improved, but optical coupling efficiency deteriorates
Solution Approach 1:
The patent employs inclined surfaces with specific curvature characteristics to facilitate both assembly and optical coupling. The first inclined surface and second inclined surface are designed with curved profiles that guide the second chip into proper position during assembly. These curved surfaces create a self-aligning effect that maintains small gaps for optimal optical coupling while still allowing easy assembly through the guiding action of the inclined surfaces.
3Adaptability or versatility
If multiple separate components (PR, PBC) are used for polarization control, then functional versatility is improved, but device complexity and chip size increase
Solution Approach 1:
The patent integrates the functions of the polarization rotator (PR) and polarization beam combiner (PBC) directly into the second chip, merging multiple separate components into a single integrated electro-optic effect chip. The second chip includes waveguides and electrodes that perform both polarization rotation and beam combining functions through electro-optic modulation, eliminating the need for separate PR and PBC components and reducing overall device complexity.
Solution Approach 2:
The second chip is designed as a multi-functional component that performs multiple functions: optical signal transmission, polarization control through electro-optic modulation, and signal combining. The electro-optic effect chip serves as a universal component that replaces multiple specialized components, reducing the total number of parts while maintaining all necessary polarization control functionalities.
4Use of energy by moving object
If chip sizes are reduced to lower driving voltages, then energy efficiency is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent divides the optical device into two separate chips: a first chip for the optical waveguide and a second chip for the electro-optic effect components. This segmentation allows each chip to be optimized independently for its specific function. The second chip can be fabricated with precise dimensions for low-voltage operation, while the first chip can be optimized for optical transmission, reducing the overall manufacturing precision burden compared to a single integrated chip.
Solution Approach 2:
The step portion is pre-formed on the first chip before mounting the second chip. This preliminary action creates a self-aligning structure that compensates for minor variations in chip fabrication dimensions. The inclined surfaces are prepared in advance to guide the second chip into proper position, reducing the impact of manufacturing precision variations on the final assembly and optical coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the workload and enhances optical coupling efficiency between optical waveguides, allowing for smaller chip sizes and lower driving voltages while minimizing misalignment and radiation losses.
Implementation Method 1
enhances optical coupling efficiency between optical waveguides, allowing for smaller chip sizes and lower driving voltages while minimizing misalignment and radiation losses
Implementation Method 2
The optical modulator 212 includes an optical waveguide and an electrode that applies an electrical signal to the optical waveguide, and optically modulates light passing through the optical waveguide by applying an electrical signal from the electrode
Data Source
AI summary
An optical integrated device includes a first chip having a step portion, and a second chip that is mounted on the step portion, and that is optically connected to the first chip. The first chip includes an optical waveguide including a material having a high electro-optic effect compared to a material of the second chip. The optical integrated device includes a first inclined surface that is formed on a wall surface on a side on which the optical waveguide and the second chip are optically connected in the step portion, and a second inclined surface that is formed on an end surface of the second chip on a side on which it is mounted within the step portion, and that abuts on the first inclined surface facing the first inclined surface.