Inclined Electrode Design for Substrate Airtightness

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Solution Overview

Problem

The reduction in electrode size on electronic component mounting substrates leads to gaps between insulating layers, compromising airtightness and bonding strength, which affects the reliability of electronic devices.

Innovation Solution

Incorporating a band-shaped metal layer on the sidewall of the recess and an electrode with an inclined end that extends into the insulating base, reducing the electrode thickness and burying the inclined portion towards the opposing main surface to enhance bonding and airtightness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the electrode size is reduced to improve compactness, then the device size is reduced, but gaps form between insulating layers around the electrode

Engineering Contradiction:

Improvedevice sizeVSAvoidairtightness

Core Design Contradiction:

Volume of moving objectVSReliability

Solution Approach 1:

The electrode end is transformed from a flat perpendicular configuration to an inclined configuration extending into the insulating base. This dimensional change in the electrode geometry allows the inclined surface to press against the insulating layers, preventing gap formation while maintaining reduced electrode footprint on the surface.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The electrode is designed with non-uniform geometry: the main body maintains standard dimensions for electrical function, while the end portion features an inclined surface with specific angular characteristics. This localized geometric modification concentrates pressure at the electrode-insulating base interface to ensure airtightness only where needed, without affecting overall device compactness.

Inventive Principle:

Principle #3Local quality

2Strength

If the electrode extends deeper into the insulating base to improve bonding strength, then bonding strength increases, but gaps form between insulating layers around the electrode

Engineering Contradiction:

Improvebonding strengthVSAvoidairtightness

Core Design Contradiction:

StrengthVSReliability

Solution Approach 1:

The electrode end features an inclined surface that creates a tapered or angled geometry rather than a sharp perpendicular edge. This curved or angled transition allows the electrode to gradually engage the insulating base material, distributing stress and preventing delamination of insulating layers while achieving sufficient bonding strength through increased embedment depth.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Data Source

PatentUS10249564B2Electronic component mounting substrate, electronic device, and electronic module

Publication Date: 2019.04.02 KYOCERA CORP

AI summary

An electronic component mounting substrate includes an insulating base having a rectangular shape in plan view and including a first main surface, a second main surface facing the first main surface, and a recess open on the first main surface, a band-shaped metal layer on a sidewall of the recess, and an electrode extending from a bottom surface of the recess into the insulating base. The electrode has an end disposed in the insulating base, and the end includes an inclined portion inclined toward the second main surface.