Indane–Polyphenylene Ether Resin Composition for Cure and Low Df
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Solution Overview
Problem
The resin described in Patent Document 1 is not sufficiently cured, lacking excellent moldability and a low dielectric loss tangent (Df), necessitating a novel resin composition blended with a thermosetting compound.
Innovation Solution
A resin composition is formulated by blending a polyphenylene ether compound with an unsaturated carbon-carbon double bond at a terminal with a resin having an isopropenyl group and an indane skeleton in specific proportions, ranging from 5/95 to 70/30.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the resin described in Patent Document 1 is used as is, then the resin has good basic properties, but the resin is not sufficiently cured and lacks excellent moldability and low dielectric loss tangent
Solution Approach 1:
The patent combines resin (A) with indane skeleton and terminal isopropenyl group with polyphenylene ether compound (B) having unsaturated terminal groups in specific proportions (5/95 to 70/30 mass ratio). This composite resin system achieves both sufficient curing through the polyphenylene ether compound and maintains excellent moldability and low dielectric loss tangent through the indane-based resin structure.
Solution Approach 2:
The patent optimizes the mass ratio parameters of resin (A) to polyphenylene ether compound (B) within the range of 5/95 to 70/30. By adjusting these compositional parameters, the resin achieves optimal balance between curing completeness, moldability, and dielectric properties. The specific proportion control enables sufficient curing while maintaining low dielectric loss tangent.
2Reliability
If the resin described in Patent Document 1 is used as is, then the resin has simple composition, but the resin lacks sufficient curing and adequate dielectric properties
Solution Approach 1:
The patent creates a composite resin system by blending resin (A) with indane skeleton with polyphenylene ether compound (B) having unsaturated terminal groups. This composite approach achieves low dielectric loss tangent and sufficient curing while keeping the composition relatively simple - only two main resin components in specific proportions, without requiring complex multi-component systems or additional curing agents.
3Reliability
If additional thermosetting compound is blended to improve curing, then the resin achieves better cure completeness, but the dielectric loss tangent increases and moldability deteriorates
Solution Approach 1:
The patent uses resin (A) with terminal isopropenyl groups and indane skeleton, which undergoes controlled polymerization to achieve sufficient curing without excessive crosslinking. The specific chemical structure parameters of resin (A) and the controlled reaction conditions enable curing completeness while maintaining low dielectric loss tangent and good moldability, avoiding the problems associated with conventional thermosetting compounds.
Solution Approach 2:
The patent introduces unsaturated terminal groups specifically at the ends of polyphenylene ether compound (B) molecules, rather than using bulk thermosetting compounds throughout the entire resin system. This localized functional group placement enables targeted curing improvement at critical interfaces while maintaining low dielectric loss in the bulk material and preserving moldability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resulting resin composition achieves excellent moldability and a low dielectric loss tangent (Df), forming a cured product with improved thermal resistance and dielectric properties.
Implementation Method 1
a polyphenylene ether compound (B) having an unsaturated carbon-carbon double bond at a terminal
Data Source
AI summary
Provided are a resin composition, a cured product, a prepreg, a metal foil-clad laminate, a resin composite sheet, a printed wiring board, and a semiconductor device. The resin composition contains a resin (A) having a terminal group represented by Formula (T1) and having an indane skeleton, and a polyphenylene ether compound (B) having an unsaturated carbon-carbon double bond at a terminal, wherein a mass ratio of a content of the resin (A) to a content of the polyphenylene ether compound (B); i.e., resin (A)/polyphenylene ether compound (B) is 5/95 to 70/30. In Formula (T1), Mb each independently represents a hydrocarbon group having from 1 to 12 carbons which may be substituted with a halogen atom; y represents an integer of 0 to 4; and * represents a bonding position with another moiety.