Indirect Laser Heating of Inorganic Materials via Metal Intermediary
Solution Overview
Problem
Existing laser heating methods face challenges in efficiently heating inorganic materials without causing thermal degradation and are limited in controlling the characteristics of the heated materials, particularly in semiconductor device manufacturing where precise and localized heating is required.
Innovation Solution
An indirect heating method using a YAG laser, diode laser, or CO2 laser where a first material structure containing metal is directly heated to generate heat that is transferred to an adjacent second material structure containing inorganic material, allowing for localized heating and reduced thermal stress on the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a laser is directly radiated to inorganic material to heat it, then heating efficiency is improved, but thermal degradation and loss of control over material characteristics occur
Solution Approach 1:
The patent introduces an intermediary material layer between the laser source and the inorganic material. This intermediary layer absorbs the laser energy and converts it to heat, which is then transferred to the inorganic material through thermal conduction. This mediator approach enables efficient heating while maintaining better control over the thermal process and preventing direct laser-material interaction that causes degradation
Solution Approach 2:
The patent changes the physical and chemical parameters of the intermediary material layer to optimize heat transfer efficiency. By adjusting parameters such as the composition, thickness, and thermal conductivity of the intermediary layer, the system achieves controlled heating of the inorganic material without direct laser exposure, thus maintaining material characteristics
2Speed
If laser heating is applied to inorganic material, then heating speed is improved, but thermal stress and degradation increase
Solution Approach 1:
The intermediary material layer acts as a buffer that absorbs laser energy and distributes heat more uniformly to the inorganic material. This reduces localized thermal stress and prevents direct laser-induced degradation while maintaining fast heating speeds through efficient thermal conduction
Solution Approach 2:
The patent considers and compensates for thermal expansion effects by selecting an intermediary material with compatible thermal expansion properties. This reduces thermal stress caused by differential expansion between layers during rapid heating, preventing degradation of the inorganic material
3Loss of time
If direct laser heating is used on inorganic material, then manufacturing time is reduced, but precision and localization of heating are compromised
Solution Approach 1:
The patent segments the heating process by introducing a patterned intermediary material layer that selectively absorbs laser energy in specific regions. This allows localized heating of the inorganic material with high precision while maintaining fast processing speeds through the efficient thermal conduction pathway
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient heating of inorganic materials to high temperatures while minimizing thermal degradation, allowing for precise control of material characteristics and reduced manufacturing time and cost, particularly in semiconductor devices like VNAND structures and DRAM capacitors.
Implementation Method 1
directly heating the first material structure to indirectly heat the second material structure adjacent to the first material structure by radiating a YAG laser, a diode laser, or a CO2 laser to the first material structure
Implementation Method 2
heat generated by radiating the laser to the first material structure may be more than heat generated by radiating the laser to the second material structure
Data Source
AI summary
An indirect heating method using a laser according to an aspect of the present disclosure includes: a first process of adjacently placing a first material structure containing metal and a second material structure containing inorganic material; and a second process of directly heating the first material structure to indirectly heat the second material structure adjacent to the first material structure by radiating a laser to the first material structure.