Induction Reflow Apparatus for Solder Ball Heating
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Solution Overview
Problem
Current methods for reflowing solder balls on semiconductor chips are inefficient and lack a comprehensive apparatus for effectively heating and processing these components during the packaging process.
Innovation Solution
A reflow apparatus comprising a power supply, a coil for heating, a support member, and a moving member that moves the treatment object through the coil's internal space, utilizing induction heating to efficiently reflow solder balls on semiconductor chips or printed circuit boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional heating methods are used for reflowing solder balls, then the heating process is simple to implement, but the heating efficiency and uniformity are insufficient
Solution Approach 1:
The patent replaces conventional thermal conduction heating with electromagnetic induction heating. The coil generates an alternating magnetic field that induces eddy currents in the solder balls, converting electromagnetic energy directly into heat within the target object. This substitution dramatically improves heating efficiency and uniformity while maintaining reasonable device complexity through the use of standard induction heating components.
Solution Approach 2:
The patent employs alternating current through the coil to generate periodically reversing magnetic fields. This periodic action ensures continuous and uniform induction heating of the solder balls as they move through the coil's magnetic field zone, maintaining consistent heating efficiency throughout the reflow process.
2Manufacturing precision
If the treatment object is moved through the coil, then uniform heating is achieved, but the positioning precision and stability are reduced
Solution Approach 1:
The patent transitions from a static heating setup to a dynamic system where the treatment object moves continuously through the coil. This dynamic configuration allows the entire surface of the solder balls to be exposed to the magnetic field uniformly, achieving consistent heating across all components while the support member maintains stable positioning during motion.
Solution Approach 2:
The patent introduces a support member as an intermediary between the treatment object and the heating system. This support member carries the solder balls through the coil's magnetic field zone, ensuring stable positioning and proper orientation while allowing uniform exposure to the alternating magnetic field, thus resolving the conflict between heating uniformity and positioning stability.
3Speed
If induction heating is used, then heating speed and efficiency are improved, but the energy consumption increases
Solution Approach 1:
The induction heating system generates heat directly within the solder balls through induced eddy currents, making the target object itself the heat source. This self-heating mechanism eliminates heat loss to surrounding components and achieves rapid heating with high energy efficiency, as the electromagnetic energy is converted directly into thermal energy where needed.
Solution Approach 2:
The patent utilizes the frequency and amplitude parameters of the alternating current to control the heating process. By optimizing these parameters, the system achieves rapid heating speeds while maintaining efficient energy utilization, as the electromagnetic field parameters can be adjusted to match the specific requirements of different solder ball configurations and material properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus ensures uniform and efficient heating of solder balls, enhancing the reliability and quality of the reflow process, thereby improving the packaging process for semiconductor chips.
Implementation Method 1
a coil configured to receive a current from the power supply to heat the treatment object
Implementation Method 2
utilizing induction heating to efficiently reflow solder balls on semiconductor chips or printed circuit boards
Implementation Method 3
a coil configured to receive a current from the power supply to heat the treatment object
Data Source
AI summary
A reflow method of a solder ball provided to a treatment object may include providing a coil, applying a current to the coil, and moving the treatment object through an internal space surrounded by the coil.