Induction Soldering for 3D PCB Assembly With Local Heating
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Solution Overview
Problem
Existing soldering technologies, particularly those using reflow methods for molded interconnected devices (MIDs) and PCBs, face limitations such as thermal damage to materials and inability to handle 3D or 2.5D structures due to spatial constraints.
Innovation Solution
The induction heating soldering automation equipment uses a non-contact induction heating method to locally heat MIDs or PCBs, allowing for continuous and automatic soldering of electronic elements while minimizing thermal damage. This system includes a jig unit, conveyors, an induction heating unit with movable magnetic induction coils, and a controller for precise control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If reflow soldering is used for MID structures, then the entire board can be soldered, but thermal damage occurs to the material and high-temperature heat limits material selection
Solution Approach 1:
The patent applies local induction heating to specifically heat only the soldering areas of the MID board rather than heating the entire board. This localized approach enables soldering while avoiding thermal damage to other components and materials on the board, thus resolving the contradiction between achieving complete soldering coverage and preventing thermal damage.
Solution Approach 2:
The heating process is segmented into discrete localized zones using multiple induction heating units positioned at different locations. Each unit independently heats its specific target area, allowing selective soldering of different regions without subjecting the entire board to high temperatures, thereby preventing thermal damage while maintaining productivity.
2Adaptability or versatility
If reflow soldering is used for 3D or 2.5D MID structures, then circuits can be implemented in three-dimensional shapes, but spatial constraints of the heating furnace limit application
Solution Approach 1:
The patent transitions from traditional horizontal furnace-based heating to vertical induction heating from above. This dimensional change allows the heating units to access and heat 3D and 2.5D MID structures from the top surface, overcoming the spatial constraints of conventional furnaces and enabling versatile application to complex three-dimensional circuit boards.
3Productivity
If traditional reflow devices are used, then soldering can be performed, but cooling time is required and electricity consumption is high
Solution Approach 1:
The induction heating system uses periodic or pulsed heating cycles to achieve soldering temperatures precisely when and where needed. This controlled periodic action allows rapid heating and cooling cycles, eliminating the need for extended cooling time required by traditional reflow methods, thus improving productivity while reducing time loss.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform quality soldering of electronic elements on MIDs or PCBs without thermal damage, allowing for the use of a wide range of materials and accommodating complex 3D structures. It also reduces the need for cooling time and minimizes electricity consumption compared to traditional reflow devices.
Implementation Method 1
an induction heating unit including a magnetic induction coil installed to be movable in X-axis, Y-axis, and Z-axis directions from an upper side of the jig unit so as to inductively heat the board mounted on the jig unit, thereby soldering the electronic element
Data Source
AI summary
The present invention relates to induction-heated soldering automation equipment and, particularly, to equipment comprising: a jig unit for fixing a substrate on which an electronic element is mounted; a first conveyor for transferring the jig unit; an induction heating unit which is provided above the jig unit so as to be movable in the X-axis, Y-axis, and Z-axis directions, and which includes a magnetic induction coil for soldering the electronic element by induction-heating the substrate fixed to the jig unit; and a controller for controlling the first conveyor and the induction heating unit, wherein continuously supplied molded interconnected devices (MIDs), PCBs, or FPCBs are locally heated through contactless induction heating so that electronic elements can be automatically soldered in a state in which thermal damage is minimized.