Heating Appliances TRIZ Cases
- Laser Desoldering of Connecting Boards Without Mainboard Overheating
Localized laser heating melts solder section by section so connecting boards can be removed without damaging the mainboard circuit area.
- Separated Inductor Chamber for Clean Vacuum Soldering
A wall-separated inductor chamber with bypass tubes keeps pressure equal during vacuum soldering, preventing coil contamination and enabling faster heating.
- Micro Wire Solder Dispensing With Vision-Guided Weld Path Planning
Vision-guided solder dispensing and path planning improve micro wire weld uniformity, productivity, and joint reliability.
- Fabric RFID Flip-Chip Attachment With Localized Pin Thermodes
Localized pin thermodes bond RFID chips to fabric antennas while curing adhesive at contact points and limiting heat and pressure damage.
- Induction Soldering for 3D PCB Assembly With Local Heating
Local non-contact induction heating solders MIDs, PCBs, and FPCBs on 3D structures while minimizing thermal damage and cooling time.
- Laser Beam Shaping for Precise Soldering Temperature Control
A split Gaussian and ring-shaped laser beam enables real-time temperature control to prevent overheating and improve soldering yield.
- Soldering Iron Tip Load Detection for Traceable Temperature Control
By measuring idle and load power at the tip, this control approach improves soldering traceability, temperature stability, and fire prevention.
- Brazing Head Force Compensation for Orientation-Dependent Control
Orientation and arm-angle sensing correct lateral force errors in laser brazing, helping maintain consistent joint formation.
- Sintering Press Tool With Flexible Membrane for Uniform Force
A flexible membrane pad and cover-supported upper tool apply uniform pressure to uneven electronic assemblies while reducing tool-change downtime.
- Vertical Reflow Soldering Chambers With Independent Thermal Control
Independent stacked process chambers enable time-offset reflow soldering with precise local heating and cooling in a smaller footprint.
- Metallic Fabric Joining With Fusible Alloy for Conductive Shielding
A fusible alloy and controlled heating join metallic fabrics while preserving conductivity continuity, shielding, and fabric integrity.
- Zeolite Box Filtration in Reflow Ovens for Stable Gas Ratios
A zeolite box adsorbs residual flux after separation, protecting oxygen sensors and stabilizing nitrogen control in reflow ovens.
- Copper-Aluminum Flame Brazing with Mixed-Gas Ratio Control
Mixed natural gas, air, and oxygen ratios stabilize flame heating in copper-aluminum brazing to avoid overheating and uneven filler penetration.
- Soldering Iron Cartridge Calibration for Traceable Temperature Control
Stored cartridge calibration and sensor feedback keep soldering tip temperature accurate, traceable, and protected from incorrect settings.
- Laser Solder Feed Duct Layout for Variable Solder Body Diameters
Interconnected laser and drop ducts simplify solder feed routing, support wider solder body sizes, and enable precise nozzle-based laser soldering.
- Soldering Iron Cartridge Control for Traceable Thermal Load Management
Cartridge memory, power-load measurement, and network logging prevent wrong tip settings, overheating, and untraceable soldering work.
- Solder Ball Feed Plate and Reservoir Gap for Clog-Free Bonding
A variable gap and gas-driven reservoir motion keep solder balls from lodging between the reservoir and feed plate, improving bonding reliability.
- Selective Solder Nozzle Exchange With Integrated Preheating
Automated gripping and magazine preheating speed selective wave solder nozzle changes while avoiding manual handling and nozzle deformation.
- Laser Solder Jetting with Gas Barrier for Clean Optical Windows
A counter-flow pressure gas barrier keeps debris off the optical window in laser solder jetting, reducing cleaning and preserving heating efficiency.
- Anode Target Plate Brazing with Induction and Beam Heating
Medium-frequency induction plus directional beam heating speeds vacuum brazing of X-ray anode target plates while improving temperature uniformity and bond quality.
- Two-Stage Laser Solder Fusing to Cut Reflection Loss
A low-power preheat laser raises solder absorption before high-power fusion, reducing reflection losses, thermal damage, and total laser power.
- Zeolite Box Gas Recirculation for Stable Reflow Oven Atmosphere
Residual flux is adsorbed in a zeolite box after separation, protecting the sensor and stabilizing gas ratios in a reflow oven.
- Soldering Station Load Detection for Tip Temperature Control
Load detection and automatic tip calibration improve soldering uniformity, prevent overheating, and extend cartridge life.
- Zeolite Box Reflow Oven for Stable Gas Ratios and Sensor Protection
Residual flux is adsorbed in a zeolite box after separation, protecting the sensor and keeping reflow oven gas ratios stable.
- Hydrogen Flame Surface Reduction for Oxide-Free Metal Joining
A diffuse hydrogen flame removes metal surface oxides under ambient conditions, avoiding flux and acids while enabling cleaner solder joints.
- Induction Brazing Heating Conductor Configuration for Uniform Heat
Multiple heating conductors position at specific length-to-diameter ratios to ensure uniform eddy current heating despite obstacles.
- Heated Roller Brazing Zinc-Coated Steel Sheets
A heated roller melts zinc-based coatings to braze steel workpieces without flux.
- Integrated Heated Jaw Soldering Tool for Dry Joint Prevention
Integrated heating jaws secure work pieces to prevent relative movement and dry joints while maintaining molten solder.
- Solar Cell Interconnector Attachment Using Automated Clamping and Heating
Automated clamping unit secures interconnectors to solar cells before thermal bonding, reducing device complexity while boosting productivity.
- Simultaneous Inner Outer Heating Brazing Large Aeronautical Parts
Inner and outer heating eliminates temperature gradients, cutting cycle time for large metal parts.