Localized laser heating melts solder section by section so connecting boards can be removed without damaging the mainboard circuit area.
A wall-separated inductor chamber with bypass tubes keeps pressure equal during vacuum soldering, preventing coil contamination and enabling faster heating.
Vision-guided solder dispensing and path planning improve micro wire weld uniformity, productivity, and joint reliability.
Localized pin thermodes bond RFID chips to fabric antennas while curing adhesive at contact points and limiting heat and pressure damage.
Local non-contact induction heating solders MIDs, PCBs, and FPCBs on 3D structures while minimizing thermal damage and cooling time.
A split Gaussian and ring-shaped laser beam enables real-time temperature control to prevent overheating and improve soldering yield.
By measuring idle and load power at the tip, this control approach improves soldering traceability, temperature stability, and fire prevention.
Orientation and arm-angle sensing correct lateral force errors in laser brazing, helping maintain consistent joint formation.
A flexible membrane pad and cover-supported upper tool apply uniform pressure to uneven electronic assemblies while reducing tool-change downtime.
Independent stacked process chambers enable time-offset reflow soldering with precise local heating and cooling in a smaller footprint.
A fusible alloy and controlled heating join metallic fabrics while preserving conductivity continuity, shielding, and fabric integrity.
A zeolite box adsorbs residual flux after separation, protecting oxygen sensors and stabilizing nitrogen control in reflow ovens.