Selective Solder Nozzle Exchange With Integrated Preheating
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Solution Overview
Problem
Existing selective soldering systems for circuit boards are time-consuming due to manual replacement of solder nozzles, which requires special protective measures and can lead to undesired deformation from oxidation, and lack efficient automated exchange processes.
Innovation Solution
A selective soldering system with a magazine on the moving unit for nozzle storage, a gripping unit controlled by the control unit for automated nozzle exchange, and preheating mechanisms to minimize start-up time, including a finger heater and magazine heater to maintain optimal temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual replacement of solder nozzles is used, then protective measures can be implemented, but the process becomes time-consuming and less efficient
Solution Approach 1:
The gripping unit automatically performs nozzle replacement operations without manual intervention. The system self-services by detecting when nozzles need replacement and executing the exchange process autonomously, eliminating the need for operators to manually handle hot nozzles while maintaining continuous production flow.
Solution Approach 2:
The patent replaces manual mechanical nozzle handling with an automated gripping unit that uses controlled mechanical movements. The gripping unit with gripping fingers substitutes human hands, and the controlled movement along z-axis replaces manual positioning, achieving both safety and efficiency.
2Ease of manufacture
If solder nozzles are manually replaced without preheating, then the process is simpler, but undesired deformation occurs due to oxidation and hardening
Solution Approach 1:
The magazine heater preheats nozzles in the magazine before they are transferred to the soldering position. This preliminary heating action prevents oxidation and deformation when nozzles are inserted into the hot solder pot, while the automated gripping unit maintains operational simplicity by handling preheated nozzles.
Solution Approach 2:
The system changes the temperature parameter of nozzles before transfer by heating them in the magazine to a controlled temperature range. This parameter change prevents thermal shock and oxidation during nozzle insertion, maintaining nozzle integrity while the automated process keeps operations simple.
3Temperature
If additional preheating equipment is added, then nozzle temperature control is improved, but device complexity increases
Solution Approach 1:
The magazine heater is integrated into the existing magazine structure, combining the storage function with the preheating function in a single component. This merging approach improves temperature control without adding separate preheating equipment, thereby avoiding increased device complexity.
Solution Approach 2:
The magazine serves multiple functions: it stores multiple nozzles, preheats them using the integrated heater, and positions them for automated transfer. This multi-functionality eliminates the need for separate preheating equipment, maintaining system simplicity while achieving excellent temperature control.
4Stability of the object's composition
If magazine is fixed separately, then nozzle storage is stable, but additional installation space is required
Solution Approach 1:
The magazine is moved from a fixed horizontal installation to a vertical configuration mounted on the moving unit. This dimensional change allows the magazine to be positioned in the vertical space above the solder pot, eliminating the need for additional horizontal installation space while maintaining stability through the moving unit's support structure.
Solution Approach 2:
The magazine is made dynamic by mounting it on the moving unit, allowing it to move together with the solder pot along x and y axes. This dynamic positioning eliminates the need for a separate fixed magazine installation, saving space while the moving unit's control system maintains precise positioning stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient and reliable automated nozzle exchange, reducing setup time and minimizing the need for additional installation space, while ensuring nozzles are preheated to operating temperature quickly, thus enhancing system efficiency.
Implementation Method 1
a magazine heater being provided for heating the magazine and/or the solder nozzles in the magazine to a preheating temperature
Implementation Method 2
a finger heater being provided for heating the gripping fingers before and/or at least during the gripping process to a preheating temperature
Implementation Method 3
it is known to hold the solder nozzle for several seconds above the solder pot at a close distance from the liquid solder before insertion, so that in particular radiant heat emanating from the solder pot heats the solder nozzle to be inserted
Data Source
AI summary
Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.