Laser Solder Feed Duct Layout for Variable Solder Body Diameters
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Solution Overview
Problem
Existing laser-assisted soldering apparatuses face difficulties in forming a supply duct within the housing, limiting the diameter of solder bodies that can be applied and requiring complex manufacturing processes.
Innovation Solution
A laser-assisted soldering apparatus with interconnected laser and drop ducts, allowing for flexible adaptation to various solder body diameters, featuring a conveying device that guides solder bodies through a guide duct and an application nozzle holder for easy nozzle exchange, and incorporating a laser shield for precise soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a separate supply duct is formed in the lower housing part, then the connecting material deposit can be conveyed to the application nozzle, but the supply duct is difficult to form and the diameter of the connecting material deposit is limited
Solution Approach 1:
The laser duct and drop duct are merged into a single interconnected duct structure. The laser duct extends from the laser entry to the laser exit, and the drop duct extends from the drop entry to the drop exit, with both ducts being interconnected over their full lengths. This allows the laser beam and solder bodies to share the same passage, eliminating the need for separate ducts and simplifying manufacturing.
Solution Approach 2:
The common duct serves multiple functions: it guides the laser beam from the laser entry to the laser exit, conveys solder bodies from the drop entry to the drop exit, and provides a universal passage that can accommodate various solder body diameters. The common entry opening at the top and common exit opening at the bottom allow both laser and solder to pass through the same structure.
2Ease of operation
If a separate supply duct is formed in the lower housing part, then the connecting material deposit can be conveyed to the application nozzle, but the device complexity increases
Solution Approach 1:
The laser duct and drop duct are merged into a single interconnected duct structure. The laser duct extends from the laser entry to the laser exit, and the drop duct extends from the drop entry to the drop exit, with both ducts being interconnected over their full lengths. This allows the laser beam and solder bodies to share the same passage, eliminating the need for separate ducts and simplifying manufacturing.
3Manufacturing precision
If the common exit opening is smaller than the common entry opening, then the application nozzle can be properly connected, but the diameter of solder bodies is limited
Solution Approach 1:
The duct has different cross-sectional dimensions at different locations. The common entry opening at the top has a larger cross-section to accommodate various solder body diameters, while the common exit opening at the bottom has a smaller cross-section optimized for connection to the application nozzle. This local variation in dimensions allows the duct to serve both functions effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the efficient application of solder bodies with diameters ranging from 0.9 μm to 2 mm, facilitating flexible manufacturing and reducing the need for expensive, long application nozzles, while ensuring precise soldering and adaptability to different applications.
Implementation Method 1
a laser beam (46) is applied to the solder body (2) held in the application nozzle (24) in order to melt or liquefy the same
Data Source
AI summary
A soldering apparatus includes an application device, a conveying device and an application nozzle. The application device has a laser duct extending straight from a laser entry at the top to a laser exit at the bottom and a drop duct that extends from a drop entry at the top to a drop exit at the bottom of the application device. The conveying device separately conveys solder bodies to the drop entry. The application nozzle temporarily holds solder bodies received from the drop exit. The laser and drop ducts are interconnected over their entire lengths from the top to the bottom of the application device. The drop entry and laser entry are side by side and form a common entry. The drop exit and laser exit are spatially coincident and form a common exit that is smaller than the common entry. The application nozzle is connected to the common exit.