Separated Inductor Chamber for Clean Vacuum Soldering
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Solution Overview
Problem
Existing methods for connecting semiconductor elements to substrates in power semiconductor modules are inefficient, unreliable, and costly, with volatile components from soldering processes contaminating induction coils and reducing process efficiency.
Innovation Solution
A method and arrangement using a process chamber with an inductor chamber separated by a thin wall, connected via bypass tubes to maintain equal pressure and prevent contamination of inductors, allowing inductive heating without coil contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If soldering is performed in a vacuum induction chamber, then heating efficiency is improved, but inductor coils become contaminated with condensed volatile components
Solution Approach 1:
The chamber is divided into two separate compartments: a process chamber for soldering and an inductor chamber for housing the induction coils. This segmentation prevents volatile components from reaching the coils while maintaining the benefits of vacuum induction heating.
Solution Approach 2:
A wall separates the process chamber from the inductor chamber, acting as a physical barrier that prevents condensed volatile components from reaching the inductors while allowing the system to maintain vacuum conditions for efficient heating.
2Object-affected harmful factors
If a physical boundary separates the inductor chamber from the process chamber, then coil contamination is prevented, but space utilization is reduced
Solution Approach 1:
A thin wall is used to separate the process chamber and inductor chamber, minimizing the space consumed by the physical boundary while still effectively preventing contamination of the inductors.
3Use of energy by moving object
If bypass tubes are used to maintain equal pressure, then heating efficiency is improved, but device complexity increases
Solution Approach 1:
Bypass tubes are used to equalize pressure between the process chamber and inductor chamber, preventing pressure differentials that would reduce heating efficiency while maintaining a relatively simple structural design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures efficient and reliable connection of semiconductor elements to substrates with reduced coil contamination, enabling faster heating and higher production capacity.
Implementation Method 1
inductively heating the one or more first connection partners with the one or more solder layers and second connection partners arranged thereon by means of the one or more inductors
Implementation Method 2
a wall separates the inductor chamber from the process chamber
Implementation Method 3
connected via bypass tubes to maintain equal pressure
Data Source
Figure 1~3
Figure 4~5
AI summary
The present application relates to an arrangement. The arrangement comprises a process chamber (400), an inductor chamber (402) with one or more inductors (60) arranged therein, a supply tube (404) configured to carry process gas from a gas source to the process chamber (400), an outlet tube (406) configured to carry process gas away from the process chamber (400), a first bypass tube (408) arranged between the supply tube (404) and the inductor chamber (402), and configured to carry process gas from the supply tube (404) to the inductor chamber (402), and a second bypass tube (410) arranged between the inductor chamber (402) and the outlet tube (406), and configured to carry process gas from the inductor chamber (402) to the outlet tube (406), wherein a wall (70) separates the inductor chamber (402) from the process chamber (400).