Micro Wire Solder Dispensing With Vision-Guided Weld Path Planning
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Solution Overview
Problem
Existing manual processes for welding micro wires in electronic devices lack precision and require skilled labor, while automated solutions fail to ensure uniform solder distribution and reliable electrical connections.
Innovation Solution
An automated welding system utilizing a solder paste distribution unit, guided by visual devices and AI, to precisely distribute solder paste, followed by controlled heating and real-time quality inspection, ensuring uniform solder distribution and reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If manual process is used for welding micro wires, then reliability of solder joint is maintained, but productivity is low and skilled labor is required
Solution Approach 1:
The patent replaces manual mechanical operations with an automated system comprising a vision device for positioning, a planning device for path generation, and a moving device for precise solder paste dispensing. This substitution eliminates the need for skilled manual labor while maintaining welding quality through automated control.
Solution Approach 2:
The system implements self-service through automated vision recognition that identifies micro wire positions and spaces, automatic path planning that generates distribution trajectories, and automated dispensing that applies solder paste without human intervention. The system serves itself by integrating sensing, planning, and execution in a closed-loop automated process.
2Productivity
If automated welding system is implemented, then productivity is improved, but manufacturing precision of solder distribution deteriorates
Solution Approach 1:
The vision device captures images of the micro wires and provides real-time position and space information to the planning device. This feedback loop enables the system to adjust the solder paste distribution path and parameters based on actual wire positions, ensuring uniform solder distribution despite automated operation.
Solution Approach 2:
The system dynamically adjusts the distribution path and dispensing parameters based on real-time vision recognition data. The planning device generates adaptive trajectories that account for variations in wire positioning, and the moving device dynamically controls solder paste flow to maintain precision throughout the automated welding process.
3Measurement precision
If visual algorithms are implemented for inspection, then measurement capability is improved, but manufacturing precision of solder distribution does not improve
Solution Approach 1:
The vision device performs preliminary measurement and positioning identification before the soldering operation. The planning device uses this advance information to pre-calculate the optimal distribution path and parameters, enabling the moving device to execute precise solder paste application that directly addresses the detected wire positions and spacing.
Solution Approach 2:
The planning device acts as an intermediary between the vision device's measurement data and the moving device's dispensing action. It translates position and space measurements into a detailed distribution path plan, bridging the gap between detection and execution to ensure that measurement precision translates into manufacturing precision.
Data Source
AI summary
A welding system for welding a pair of micro wires of an electronic device together includes a solder paste distribution unit. The solder paste distribution unit has a carrier loading and fixing the electronic device, a solder paste dispenser spraying a solder paste outward, a visual device identifying a position of the pair of micro wires and a space between the pair of micro wires, a planning device pre-planning a starting position, an ending position, and a distribution path of the solder paste based on the position and the space of the pair of micro wires recognized by the visual device. A moving device moves the solder paste dispenser at a predetermined speed according to the starting position, the ending position, and the distribution path to distribute the solder paste to a plurality of predetermined locations of the pair of micro wires.