Two-Stage Laser Solder Fusing to Cut Reflection Loss

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Solution Overview

Problem

Existing methods for fusing solder material deposits using laser energy face inefficiencies due to significant energy losses from radiation reflection, requiring high laser power to achieve the necessary heating for fusion.

Innovation Solution

A method employing two laser devices with different power levels, where a lower-power first laser source heats the solder material to increase its absorption capacity, allowing a higher-power second laser source to efficiently reach the melting temperature with reduced energy input, thereby minimizing reflection losses and enabling precise power control.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If high laser power is used to fuse the solder material deposit, then the fusion process can be completed, but significant energy losses occur due to radiation reflection

Engineering Contradiction:
Improvefusion speedVSAvoidradiation reflection loss
Core Design Contradiction:
ProductivityVSLoss of energy

Solution Approach 1:

The invention applies a preliminary heating phase using a first laser source with lower power to increase the temperature of the solder material deposit before the main fusion phase. This preliminary action increases the absorption capacity of the solder material, reducing reflection losses during the subsequent high-power fusion phase with the second laser source.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention changes the temperature parameter of the solder material deposit through preliminary heating, which fundamentally alters its optical properties. By increasing the temperature from ambient to a higher level (but below melting point) in the first phase, the absorption capacity increases and reflection capacity decreases, enabling more efficient energy coupling in the second phase.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If high laser power is applied directly to the solder material deposit, then fusion can be achieved, but thermal damage may occur

Engineering Contradiction:
Improvefusion speedVSAvoidthermal damage
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The first laser source performs preliminary heating to bring the solder material deposit to an optimal temperature range that increases absorption capacity without causing thermal damage. This preparatory step ensures that when the second laser source applies high power for fusion, the material is already in a state that requires less additional energy, reducing the risk of overheating and thermal damage.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention divides the laser application into two distinct periodic phases: a first phase with lower power for heating and increasing absorption capacity, and a second phase with higher power for completing the fusion. This periodic structure allows controlled energy input that avoids the harmful effects of continuous high-power application while maintaining high productivity.

Inventive Principle:
Principle #19Periodic action

3Productivity

If a single high-power laser source is used for fusion, then the process can be completed quickly, but precise power control becomes difficult

Engineering Contradiction:
Improvefusion speedVSAvoidpower control precision
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The invention segments the laser power application into two distinct phases with two different laser sources: a first laser source operating at lower power levels suitable for precise control during the heating phase, and a second laser source operating at higher power levels for the fusion phase. This segmentation allows each laser source to operate in its optimal control range, improving overall power control precision while maintaining high productivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention dynamically adjusts the laser power levels by switching between two different laser sources based on the process phase. The system transitions from a first dynamic state with lower power (suitable for precise control during heating) to a second dynamic state with higher power (suitable for rapid fusion), optimizing both control precision and productivity at different stages of the process.

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the overall laser power required, prevents thermal damage, and allows for cost-effective miniaturization of the laser arrangement while enhancing energy effectiveness and control during the fusion process.

Implementation Method 1

The solder material is heated due to the absorption of laser energy emitted from a laser source in the form of radiation

Methodology Applied
Scientific EffectAbsorption of laser energy: Absorption (EM radiation)

Implementation Method 2

the smaller the portion of the laser radiation which is reflected from the solder material as reflection radiation without contributing to its heating

Methodology Applied
Scientific EffectReflection radiation: Reflection

Data Source

PatentUS11554434B2Method and laser arrangement for fusing a solder material deposit by means of laser energy
Publication Date: 2023.01.17 PAC TECH PACKAGING TECH
  • US11554434B2 patent drawing

AI summary

The invention relates to a method for fusing a solder material deposit by means of laser energy, in which laser radiation emitted from a first laser source is applied to the solder material deposit in a first application phase by means of a first laser device (11) and laser radiation emitted from a second laser source is applied to the solder material deposit in a second application phase by means of a second laser device (12), said first laser source having a lower laser power than the second laser source, a switch being made from the first application phase to the second application phase by means of a switching device (30) and said switch being triggered by a temperature sensor, by means of which the temperature of the solder material deposit is measured at least during the first application phase.