Laser Desoldering of Connecting Boards Without Mainboard Overheating
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Solution Overview
Problem
Existing desoldering methods using hot air blowers to remove connecting boards from mainboards risk overheating and damaging the mainboard's circuit system due to excessive heat, which can destroy the protective glue and the circuit system.
Innovation Solution
A desoldering equipment with a laser heating member that heats the connecting board section by section along a preset path, using a carrier and grabbing assembly to remove the board without damaging the mainboard, and includes a supporting assembly to position the board accurately.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a hot air blower is used to heat the connecting board, then the solder paste melts and the connecting board can be removed, but the temperature of the mainboard area with the circuit system becomes too high and the protective glue melts, destroying the circuit system
Solution Approach 1:
The patent applies local quality by using a laser heating device to concentrate heat precisely on the connecting board area only, rather than heating the entire mainboard. The laser beam is directed specifically at the solder joints of the connecting board, creating a localized high-temperature zone that melts the solder paste without raising the temperature of the surrounding mainboard circuit system. This selective localized heating resolves the contradiction by achieving the necessary temperature for solder melting while preventing heat damage to sensitive circuit areas.
Solution Approach 2:
The patent segments the heating process by dividing the mainboard into distinct zones: the connecting board area that requires heating and the circuit system area that must be protected. By using a laser heating device with controlled beam direction and positioning, the heating action is segmented to affect only the connecting board and its solder joints, while the circuit system remains in a separate, unheated zone. This spatial segmentation allows independent temperature control of different regions, resolving the contradiction between melting solder and protecting circuits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents overheating of the mainboard's circuit area, allowing safe removal and reuse of the mainboard by concentrating heat on the connecting board, reducing damage and saving costs.
Implementation Method 1
a laser heating member configured to heat the connecting board in the carrier section by section according to a preset path
Data Source
AI summary
A desoldering equipment includes a carrier, a conveying assembly, a supporting assembly, a pressing assembly, a laser heating member, and a grabbing assembly. The carrier is configured to position a connecting board and a mainboard. The conveying assembly is configured to convey the carrier to a desoldering position along a first direction. The supporting assembly is arranged under the conveying assembly and configured to position the carrier at the desoldering position. The pressing assembly is arranged above the conveying assembly and configured to press down the mainboard in the carrier at the desoldering position. The laser heating member is configured to heat the connecting board in the carrier at the desoldering position. The grabbing assembly is configured to grab the connecting board on the mainboard pressed down by the pressing assembly and remove the connecting board. The desoldering equipment can remove the connecting board without damaging the mainboard.