Dual-Output Inductive Pedal Sensor Layout for Low Coil Coupling
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Solution Overview
Problem
Existing vehicle accelerator pedals with redundant dual output inductive position sensors experience increased coupling between transmit and receiver coil circuits, leading to potential malfunctions due to interactions between magnetic fields, especially in cases of short or open circuit conditions.
Innovation Solution
The design positions the first and second inductive transmit and receiver coil circuits on separate sections of the substrate, with the receiver coil circuits being at least partially surrounded by the transmit coil circuits, reducing the coupling factor and minimizing interference between magnetic fields.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If transmit and receiver coil circuits are positioned close together on the substrate, then the sensor can detect position accurately, but the coupling factor between coil circuits increases causing magnetic field interactions and potential malfunctions
Solution Approach 1:
The substrate is divided into multiple sections, with each section containing a complete transmit and receiver coil circuit. This segmentation isolates the magnetic fields of different coil circuits to specific sections, reducing unwanted coupling between circuits while maintaining position detection accuracy within each section.
Solution Approach 2:
The substrate itself acts as an intermediary element that provides both mechanical support and magnetic field management. By positioning coil circuits on different sections of the substrate and using the substrate material properties, the design reduces direct magnetic coupling between transmit and receiver coils of different circuits.
2Reliability
If multiple inductive coil circuits are integrated on the same substrate, then the sensor provides redundant dual output for enhanced reliability, but the magnetic fields interact causing coupling effects that may lead to malfunctions
Solution Approach 1:
The substrate is divided into multiple sections, with each section containing a complete transmit and receiver coil circuit. This segmentation isolates the magnetic fields of different coil circuits to specific sections, reducing unwanted coupling between circuits while maintaining position detection accuracy within each section.
Solution Approach 2:
Each section of the substrate is designed with specific coil circuit configurations optimized for local position detection. The transmit and receiver coils in each section are positioned and sized to provide appropriate magnetic field strength for detection while minimizing interference with other sections, creating local quality variations that reduce overall coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the risk of malfunction in the event of a short or open circuit condition by minimizing the interaction between magnetic fields, thereby enhancing the reliability of the redundant inductive position sensor system.
Implementation Method 1
an inductive position sensor including an inductive sensor target rotatable in response to the rotation of the pedal, a substrate positioned opposite the inductive sensor target, a first inductive transmit and receiver coil circuit defined on the substrate
Implementation Method 2
the receiver coil circuits being at least partially surrounded by the transmit coil circuits, reducing the coupling factor between the transmit and receiver coil circuits
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A vehicle pedal assembly comprising a pedal housing, a rotatable pedal, and an inductive position sensor. The inductive position sensor includes an inductive sensor target rotatable in response to the rotation of the pedal and a substrate positioned opposite the inductive sensor target. First and second redundant inductive transmit and receiver coil circuits are defined and located on different sections of the substrate in a relationship with the respective receiver coil circuits of the first and second transmit and receiver coil circuits at least partially surrounded by the respective transmit coil circuits of the first and second transmit and receiver coil circuits for reducing the coupling factor between the first and second transmit and receiver coil circuits.