Inductor Busbar Module Layout for Compact Power Conversion
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Solution Overview
Problem
Modern power electronics require high power and high power density, necessitating improved fastening structures between components to enhance heat dissipation and power efficiency while optimizing space efficiency and seismic resistance.
Innovation Solution
The electronic component module includes a first printed circuit board with an inductor featuring a core and a coil, a metal plate, and a busbar. The inductor's terminals are coupled to the metal plate and busbar, respectively, allowing for efficient coupling and compact integration, thereby increasing space efficiency and power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If traditional fastening structures are used between components, then assembly is simpler, but heat dissipation and power efficiency are insufficient
Solution Approach 1:
The busbar is integrated to simultaneously provide electrical connection between the inductor and printed circuit board while serving as a heat dissipation pathway. This merging of electrical and thermal functions into a single component reduces the number of separate fastening structures needed while improving both power efficiency and heat dissipation.
Solution Approach 2:
The busbar performs multiple functions: electrical conduction, mechanical support, and heat dissipation. By making the fastening structure multi-functional, the design improves thermal management and power efficiency without requiring additional dedicated cooling structures.
2Reliability
If components are arranged to maximize isolation distances and power paths, then safety and reliability are improved, but space efficiency and power density decrease
Solution Approach 1:
The busbar extends vertically from the inductor to connect with the printed circuit board, utilizing the vertical dimension rather than only horizontal spacing. This dimensional transition allows maintaining necessary isolation distances while reducing the horizontal footprint and overall module volume.
Solution Approach 2:
Isolation distances are optimized locally at critical interfaces (such as between the inductor and surrounding components) while minimizing spacing in non-critical areas. The busbar placement is strategically positioned to provide necessary electrical and thermal connection while occupying minimal space.
Data Source
AI summary
An electronic component module comprises: a first printed circuit board; an inductor disposed on the first printed circuit board and comprising a core, and a first coil disposed in the core; a metal plate disposed on the inductor, and a busbar disposed on the lower portion of the inductor and coupled to the first printed circuit board, wherein the first coil comprises a first terminal protruding upward from the core, and a second terminal protruding downward from the core, and the first terminal is coupled to the metal plate, and the second terminal is coupled to the busbar.