Surface Mounted Inductor Molding with Dual-Temperature Compression
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Solution Overview
Problem
Existing manufacturing methods for surface mounted inductors face challenges in miniaturization due to mechanical strength issues with sealing materials containing resin and filler, leading to defects and misalignment, which affect DC resistance and DC superimposed characteristics.
Innovation Solution
A manufacturing method involving a coil with lead-out ends positioned at the outer periphery and a tablet with a positioning mechanism, where the tablet is compressed at two different temperatures to secure the coil within a molding die, reducing the thickness between the coil and the die surfaces, thereby improving mechanical strength and characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the thickness of pillar-shaped convex portions of the tablet is reduced to enable miniaturization, then the size of the surface mounted inductor is reduced, but the mechanical strength of the tablet deteriorates causing defects and misalignment
Solution Approach 1:
The patent changes the temperature parameter during the molding process. By controlling the temperature within a specific range (50°C to 150°C), the resin in the sealing material becomes sufficiently soft to enable miniaturization while maintaining mechanical strength. This temperature control allows the tablet to be formed with reduced thickness without causing defects or misalignment.
Solution Approach 2:
The patent applies preliminary heating to the sealing material before molding. By pre-heating the sealing material containing the resin and filler to the specified temperature range, the material becomes more pliable and easier to form into the required shape with reduced thickness, preventing mechanical strength deterioration during the miniaturization process.
2Strength
If the thickness of pillar-shaped convex portions is increased to maintain mechanical strength, then the tablet can be formed without defects, but the coil size becomes small causing deterioration of DC resistance and DC superimposed characteristics
Solution Approach 1:
The patent changes the temperature parameter to resolve this contradiction. By controlling the temperature during molding, the resin achieves optimal softness that allows the tablet to maintain mechanical strength with reduced thickness, thereby enabling the coil to be formed with sufficient size for acceptable electrical characteristics.
3Manufacturing precision
If the sealing material is preformed into a complicated shape with pillar-shaped convex portions, then the coil positioning is improved, but it becomes difficult to secure sufficient mechanical strength when miniaturized
Solution Approach 1:
The patent applies temperature control as the key parameter change. By heating the sealing material to 50°C to 150°C during the preforming process, the material becomes sufficiently soft to be formed into the complicated shape with pillar-shaped convex portions while maintaining mechanical strength even when miniaturized. This enables both precise coil positioning and adequate mechanical strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables miniaturization of surface mounted inductors with reduced DC resistance and improved DC superimposed characteristics by enhancing mechanical strength and alignment during the molding process.
Implementation Method 1
the coil and the sealing material are integrated by a compression molding method or a powder compacting method
Implementation Method 2
the coil and the tablet are pressurized in the molding die at a second temperature higher than the first temperature to form a formed body incorporating the coil
Data Source
AI summary
A manufacturing method of a surface mounted inductor involves using a coil and a tablet in a molding die. The coil is placed on the tablet. The coil and the tablet are arranged in the molding die and pressurized and compressed to the size of the cavity in the molding die at a first temperature. The coil and the tablet are pressurized in the molding die at a second temperature higher than the first temperature to form a formed body incorporating the coil.