Transformers/Inductances Casings TRIZ Cases
- Electronic Device Package Box Pin Arrangement
A package box uses staggered connecting pins to simplify wire assembly.
- Powder Core Coupled Inductor Adjustable Leakage
Embedding windings in a segmented powder magnetic core allows adjustable leakage inductance to resolve ripple current management challenges.
- Wire Wound Part Groove Stabilizes Solder Position
Vertical groove side walls constrain molten solder laterally, preventing unstable height and attitude fluctuations on circuit substrates.
- Wire-Wound Power Inductor Core Segmentation for Permeability
Segmented core bodies align magnetic powder flakes parallel to the coil field, resolving stacking complexity while boosting permeability.
- Coil Component Glass Surface Layer Adhesion
Glass surface layer on ferrite cores improves wettability and curing completeness, ensuring strong adhesive bonding for compact coil components.
- Ferrite Pillar Coil with Metal Powder Sheath for Saturation
Ferrite pillar coil uses metal powder sheath to boost inductance while raising saturated current limits.
- Moisture Protection for Inductive Sensor Coils
Segmented base and barrier layers prevent moisture absorption that alters coil geometry and degrades measurement accuracy.
- Rectangular Wire Coil With Edgewise Winding For Miniaturization
A rectangular wire coil uses edgewise winding to eliminate welding and folding steps in reactor manufacturing.
- Reactor Core Coil Groove Molding for Void Elimination
Axial grooves in the coil structure guide resin flow to fill interlayer spaces, preventing foreign material entry and improving vibration resistance.
- Coil Component Adhesive Layer Prevents Magnetic Body Chipping
An adhesive layer between the insulating and magnetic bodies prevents chipping during cutting operations, ensuring reliable inductor integrity.
- SIP Inductor Gap Prevents Dielectric Breakdown
Spacing the inductor body at least 100 μm from the leadframe prevents dielectric breakdown caused by electric fields.
- Grid Housing for Air-Gapped Magnetic Cores
Segmented chambers eliminate stacking and gluing steps, resolving alignment challenges in magnetic core manufacturing.
- Coupled Inductor Film Process Gap Control
Film process forms coils on magnetic sheet surfaces to control gap variations, reducing coupling coefficient standard deviation.
- Shielded Magnetic Device Conductive Layer EMI Reduction
A conductive shielding layer covers the magnetic device body to prevent magnetic field leakage.
- Choke With Variable Cross-Section Coil For Low Resistance
A choke coil features a varying cross-section with narrow inner and wide outer portions to reduce electrical resistance.
- Coil Device Electrode Segmentation for Bonding Reliability
Segmented electrode protects connecting wires from external impacts and residual stress while maintaining reliable bonding conditions during reflow.
- Surface Mount Inductor Resin Coating Insulation
Resin coating on molded body improves withstand voltage while maintaining terminal connection strength.
- System in Package Inductor Nesting for Thickness Reduction
A system in package module embeds an inductor magnetic core protrusion within a substrate accommodation groove to house the inductive coil.