Electronic Device Package Box Pin Arrangement

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Solution Overview

Problem

Conventional electronic device package boxes have inconveniently long protruding second connecting pins, making it difficult to entwine second conducting wires around the wire-connecting portions of the pins.

Innovation Solution

The electronic device package box design features first and second base units with staggered rows of connecting pins and pin-protruding surfaces, allowing for easier entwining of conducting wires and simplifying the assembly process by reducing the need for a tin welding process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the second connecting pins are made long to protrude from the cover unit, then the electrical connection is achieved, but the entwining of second conducting wires becomes inconvenient

Engineering Contradiction:

Improveelectrical connectionVSAvoidentwining of conducting wires

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The patent repositions the wire-connecting portions of the second connecting pins from protruding outward (one-dimensional extension) to being located on the opposite side of the base unit (spatial reconfiguration). This dimensional change allows conducting wires to be entwined from a more accessible direction, solving the operational difficulty while maintaining electrical connection reliability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Instead of having the wire-connecting portions protrude outward from the cover unit as in conventional designs, the patent inverts the arrangement by positioning these portions on the opposite side of the base unit. This inversion makes the wire-connecting portions more accessible for entwining operations while achieving the same electrical connection function.

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If the second connecting pins protrude long from the cover unit, then connection is established, but assembly complexity increases

Engineering Contradiction:

ImproveconnectionVSAvoidassembly complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent inverts the conventional arrangement by positioning the wire-connecting portions on the opposite side of the base unit rather than protruding outward. This inversion simplifies the assembly process by making wire entwining more accessible and reducing the overall complexity of the connection assembly, while maintaining reliable electrical connection.

Inventive Principle:

Principle #13The other way round (Inversion)

Data Source

PatentUS9526188B2Electronic device package box

Publication Date: 2016.12.20 CHILISIN ELECTRONICS

AI summary

An electronic device package box includes a first base unit including a first base and multiple first connecting pins, and a second base unit including a second base and multiple second connecting pins inserted into the first and second bases. The first base has a first abutment surface and a first pin-protruding surface. Each of the first connecting pins has a first wire-connecting portion projecting from the first pin-protruding surface. The second base has a second abutment surface abutting against the first abutment surface, and a second pin-protruding surface. Each of the second connecting pins has a second wire-connecting portion projecting from the second pin-protruding surface and a protrusion portion projecting from the first pin-protruding surface.