System in Package Inductor Nesting for Thickness Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing system in package modules are thick due to the placement of inductors and electronic components, which hinders the thinness and compactness required for portable electronic devices, and also face challenges in heat dissipation and protection of components.
Innovation Solution
The system in package module assembly features a substrate with an accommodation groove for a magnetic core and inductive coil, where the inductor's magnetic core protrusion is positioned within the groove, allowing the inductive coil to be partially or fully housed in the substrate, reducing thickness, and includes a plastic package body and heat dissipation cover for protection and heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the inductor is disposed above the chip on the substrate surface, then the inductor can be easily assembled, but the thickness of the system in package module increases
Solution Approach 1:
The magnetic core is partially embedded into the substrate, with a protrusion extending upward to accommodate the inductive coil. This nesting approach allows the inductor to be integrated within the substrate structure rather than placed entirely above it, reducing the overall thickness while maintaining assembly feasibility through the protrusion-coil interface
Solution Approach 2:
The inductor structure transitions from a planar arrangement (entirely above the chip) to a three-dimensional configuration where the magnetic core extends into the substrate thickness direction. The protrusion of the magnetic core creates a vertical dimension for coil placement, reducing the horizontal footprint and overall module thickness
2Volume of moving object
If electronic components are covered in an extremely small package, then space is saved and power consumption is low, but heat dissipation becomes difficult
Solution Approach 1:
The magnetic core is segmented into a base portion embedded in the substrate and a protrusion extending upward. This segmentation creates internal void spaces within the substrate structure that can be filled with heat dissipation materials, allowing heat to conduct through multiple paths while maintaining compact packaging
Solution Approach 2:
Heat dissipation material is introduced as an intermediary substance filling the accommodation groove and surrounding the magnetic core protrusion. This intermediary material provides a thermal conduction path between the inductor (heat source) and the substrate (heat sink), enabling effective heat dissipation within the compact package structure
3Reliability
If the inductive coil is welded directly to the substrate, then electrical connection is achieved, but heat dissipation from the magnetic core is limited
Solution Approach 1:
A heat dissipation material is introduced as an intermediary between the magnetic core and the substrate, filling the accommodation groove. This intermediary serves dual purposes: it provides thermal conduction pathways for heat dissipation while allowing the inductive coil to maintain its electrical connection to the substrate through the magnetic core structure
Data Source
AI summary
A system in package module assembly is provided, and includes: a substrate, and a chip, an inductor, and an electrical element that are electrically connected to the substrate. The substrate includes a first surface, a second surface opposite to the first surface, and an accommodation groove. The accommodation groove passes through the second surface and the first surface. The inductor includes a magnetic core and an inductive coil. The magnetic core includes a base and a protrusion disposed on an outer surface of the base. The outer surface on which the protrusion is disposed and that is of the base abuts on the second surface. The protrusion is accommodated in the accommodation groove. The inductive coil is disposed in the protrusion. A system in package module and an electronic device are further provided.