Wire Wound Part Groove Stabilizes Solder Position
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Solution Overview
Problem
Existing wire wound electronic parts face instability in height and attitude during mounting to a circuit substrate due to fluctuations in terminal electrode size and solder movement, primarily caused by the shape of the groove at the bottom of the flange.
Innovation Solution
The design includes grooves at the bottom of the flange with slanted side walls that restrict the movement of molten solder in the lateral direction, ensuring the terminal electrodes are contained within the groove, thereby stabilizing the edge portions and preventing lateral size fluctuations, with the vertical height of the side walls being larger than the length of the bottom and the terminal electrodes' thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the groove at the bottom of the flange has moderate slopes with the bottom length larger than vertical height, then the terminal electrode can be formed in the groove, but the lateral size of the terminal electrode fluctuates and the height and attitude become unstable during mounting
Solution Approach 1:
The groove structure is changed from symmetric moderate slopes to an asymmetric configuration with vertical side walls. The side walls extend vertically from the bottom of the groove, creating a rectangular cross-section that provides stable lateral boundaries for the terminal electrode, eliminating the fluctuation caused by the previous symmetric sloped structure.
Solution Approach 2:
The geometric parameters of the groove are modified: the side walls are made vertical with height greater than the bottom length, changing the slope angle from moderate to 90 degrees. This parameter change transforms the groove from a sloped configuration to a vertical-walled configuration, providing stable containment for the terminal electrode and preventing lateral size fluctuation.
2Ease of manufacture
If the terminal electrode edge portions are positioned on the moderate slopes of the groove, then the electrode can be formed, but the edge portion position fluctuates in the lateral direction causing unstable lateral size
Solution Approach 1:
The groove structure is changed from symmetric moderate slopes to an asymmetric configuration with vertical side walls. The side walls extend vertically from the bottom of the groove, creating a rectangular cross-section that provides stable lateral boundaries for the terminal electrode, eliminating the fluctuation caused by the previous symmetric sloped structure.
Solution Approach 2:
The groove structure is pre-formed with vertical side walls that define the exact lateral boundaries for the terminal electrode before the electrode formation process. This preliminary structural preparation ensures that the electrode edge portions are automatically positioned at the correct lateral locations, preventing position fluctuation during manufacturing.
3Ease of manufacture
If solder is placed between the flat surface of the bottom and the moderate slope of the groove, then the terminal electrode can be connected, but the molten solder moves in the lateral direction during mounting causing unstable height and attitude
Solution Approach 1:
The groove structure is changed from symmetric moderate slopes to an asymmetric configuration with vertical side walls. The side walls extend vertically from the bottom of the groove, creating a rectangular cross-section that provides stable lateral boundaries for the terminal electrode, eliminating the fluctuation caused by the previous symmetric sloped structure.
Solution Approach 2:
The vertical side walls of the groove are designed to preemptively counteract the lateral movement tendency of molten solder during the mounting process. By providing vertical boundaries before soldering occurs, the structure prevents solder from flowing laterally, thereby maintaining stable height and attitude of the mounted component.
Data Source
AI summary
A wire wound electronic part includes a core having a wire wound core and flanges formed on both ends thereof, a coil conductor wound around the wire wound core and terminal electrodes disposed at the bottom of the flange, in which both ends of the coil conductor are conductively connected to the terminal electrodes by a solder, wherein a pair of grooves are formed at the bottom crossing the wire wound core of one of the flanges. The groove has a bottom and side walls disposed being slanted on both sides thereof, in which the vertical height for the side wall is formed larger than the length for the bottom of the side wall. The terminal electrodes are contained in the groove, and edge portion in the lateral direction of the terminal electrode is restricted by the side wall of the groove. The edge portion in the lateral direction of the terminal electrode is restricted by the side wall of the groove, which makes the lateral size stable and suppresses the movement of the molten solder in the lateral direction of the groove, thereby preventing unstable height and attitude of the wire wound electronic part upon mounting to a circuit substrate.