Inductor Mounting Structure for Higher Q and Thermal Stress Relief
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional inductor components face challenges in increasing inductance efficiency and coil strength due to limited inner diameter and thermal stress from differences in linear expansion coefficients between the coil and element body.
Innovation Solution
The inductor component design includes a spiral coil with multiple wirings arranged along the shorter dimension of the element body, ensuring a larger inner diameter and secure winding count, while using insulating layers to protect wirings and reduce thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If the coil is wound along the length direction of the element body, then the number of windings can be increased, but the inner diameter of the coil becomes small and inductance acquisition efficiency decreases
Solution Approach 1:
The patent changes the winding direction from the length direction to the width direction of the element body. This dimensional change allows the coil to achieve a larger inner diameter while maintaining an adequate number of windings, thereby improving inductance acquisition efficiency without sacrificing the quantity of windings.
2Productivity
If the number of windings is increased to improve inductance, then inductance efficiency increases, but thermal stress from linear expansion coefficient difference between coil and element body increases
Solution Approach 1:
The patent optimizes the ratio of the radius of the equivalent circle diameter of the end surface of each through wiring (r1) to the minimum distance between end surfaces of adjacent through wirings (g1), setting r1/g1 ≤ 4. This parameter change ensures adequate substrate volume between through wirings, which improves strength against thermal load while maintaining the number of windings and inductance acquisition efficiency.
3Productivity
If the inner diameter of the coil is increased to improve inductance efficiency, then inductance acquisition efficiency increases, but the number of windings decreases
Solution Approach 1:
By changing the winding direction to along the width direction of the element body, the patent achieves a larger inner diameter for the coil while maintaining sufficient space for an adequate number of windings. This dimensional change resolves the trade-off between inner diameter size and winding count.
4Productivity
If through wirings are densely arranged to increase number of windings, then inductance efficiency increases, but substrate strength against thermal load decreases
Solution Approach 1:
The patent sets the ratio r1/g1 ≤ 4, where r1 is the radius of the equivalent circle diameter of the end surface of each through wiring and g1 is the minimum distance between end surfaces of adjacent through wirings. This parameter control ensures that adequate substrate volume is maintained between through wirings, preserving substrate strength against thermal load while allowing sufficient density for inductance acquisition efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances inductance efficiency and coil strength by securing the number of windings and reducing thermal stress, allowing for a smaller, lighter component with improved Q value and reduced direct current resistance.
Implementation Method 1
a coil provided on the element body, having a spiral shape and wound along an axis
Implementation Method 2
securing strength against a thermal load caused by a difference in linear expansion coefficient between the coil and an element body
Data Source
AI summary
An inductor component includes an element body, a coil on the body and spirally wound along an axis, first and second external electrodes electrically connected to the coil, and first and second through wirings which penetrate a substrate of the element body between main surfaces. The first coil wirings and through wirings, and the second coil wirings and through wirings, are connected as follows. With respect to two of the first through wirings adjacent to each other in a direction of the axis, on the first main surface, a relationship between a radius of an equivalent circle diameter of an end surface of each of the first through wirings and a minimum distance between end surfaces of the two first through wirings is satisfied, and with respect to two of the second through wirings adjacent to each other in the direction of the axis, a similar relationship is satisfied.